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COM Express®
COM-HPC®
Qseven®
SMARC®
Myon MicroModule (SOM)
Trizeps SODIMM (SOM)
ETX®

Computer on Module

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今購入中：
  1. Mass Storage
    onboard eMMC
  2. Video Interfaces
    SINGLE CHANNEL LVDS
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Shopping Options
Cpu Maker
  1. Intel 2 items
  2. MediaTek 1 item
  3. NXP 1 item
Cpu Type
  1. Intel® Atom™ 1 item
  2. Intel® Core™ 2 items
  3. MediaTek Genio360 1 item
  4. NXP i.MX 952 1 item
Ethernet
  1. ETHERNET≥1 4 items
  2. ETHERNET≥2 2 items
Form Factor
  1. COM Express® 2 items
  2. SMARC 1 item
  3. Trizeps SODIMM SOM 1 item
Form Factor Dimensions
  1. 67,6 x 36,7 mm 1 item
  2. ≤ 100 x 100mm 3 items
Form Factor Specification
  1. COM Express Compact 2 items
  2. ≤ 100 x 100mm 1 item
Memory
  1. memory ≤1 4 items
  2. memory ≤16 3 items
  3. memory ≤2 4 items
  4. memory ≤4 4 items
  5. memory ≤8 3 items
  6. SO_DIMM 2 items
Mass Storage
  1. onboard SSD 1 item
  2. soldered down 1 item
  3. CFAST slot 1 item
  4. M.2 NVMe SSD slot 2 items
  5. microSD card slot 4 items
  6. onboard eMMC 19 items
  7. onboard eMMC 4 items
  8. SATA channels ≥ 1 14 items
  9. SATA channels ≥ 1 3 items
  10. SATA channels ≥ 2 3 items
  11. SATA channels ≥ 2 12 items
  12. SATA channels ≥ 3 3 items
  13. SATA channels ≥ 4 1 item
  14. SD interface 12 items
  15. SD interface 2 items
  16. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 2 items
Operating Temperature
  1. -20°C ÷ +60°C 3 items
  2. -40°C ÷ +85°C 4 items
  3. 0°C ÷ +50°C 3 items
  4. 0°C ÷ +60°C 3 items
  5. 20°C ÷ +70°C 3 items
  6. -20°C ÷ +70°C 1 item
  7. -20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 3 items
  2. PCI-e lanes ≥ 2 3 items
  3. PCI-e lanes ≥ 3 2 items
  4. PCI-e lanes ≥ 4 2 items
  5. PCI-e lanes ≥ 5 2 items
Ttl Uarts
  1. TTL Uarts ≥1 4 items
  2. TTL Uarts ≥2 4 items
  3. TTL Uarts ≥3 2 items
USB
  1. USB 2.0 ≥ 1 3 items
  2. USB 2.0 ≥ 2 3 items
  3. USB 2.0 ≥ 3 3 items
  4. USB 2.0 ≥ 4 3 items
  5. USB 2.0 ≥ 5 3 items
  6. USB 2.0 ≥ 6 3 items
  7. USB 3.0 ≥ 1 3 items
  8. USB 3.0 ≥ 2 3 items
  9. USB 3.0 ≥ 3 2 items
  10. USB 3.1 ≥ 1 2 items
  11. USB 3.1 ≥ 2 2 items
  12. USB OTG 1 item
Video Interfaces
  1. DDI 2 items
  2. DP 5 items
  3. DUAL CHANNEL LVDS 4 items
  4. eDP 5 items
  5. HDMI 5 items
  6. MIPI-CSI camera conn 2 items
  7. MIPI-DSI 3 items
  8. PARALLEL RGB 1 item
  9. SINGLE CHANNEL LVDS 4 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®