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Computer on Module
COM Express®
COM-HPC®
Qseven®
SMARC®
Myon MicroModule (SOM)
Trizeps SODIMM (SOM)
ETX®

Computer on Module

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今購入中：
  1. Mass Storage
    microSD card slot
  2. Operating Temperature
    -40°C ÷ +85°C
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Cpu Maker
  1. Intel 1 item
  2. NXP 2 items
  3. Rockchip 1 item
Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range < 10 W 3 items
  3. range > 25 W 1 item
Cpu Type
  1. Intel® Atom™ 1 item
  2. Intel® Celeron® 1 item
  3. Intel® Pentium® 1 item
  4. NXP i.MX 8M 1 item
  5. NXP i.MX6 1 item
  6. Rockchip RK3588 1 item
Form Factor
  1. COM Express® 2 items
  2. Qseven 2 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. ≤ 100 x 100mm 2 items
  3. ≤ 80 x 80mm 2 items
  4. ≥ 100 x 100mm 1 item
Form Factor Specification
  1. COM Express Basic 1 item
  2. COM Express Compact 1 item
  3. Qseven 70x70 mm 2 items
Memory
  1. memory ≤1 3 items
  2. memory ≤2 3 items
  3. memory ≤4 3 items
  4. memory ≤8 1 item
  5. memory ≥32 1 item
  6. soldered down 2 items
  7. SO_DIMM 1 item
Mass Storage
  1. onboard SSD 1 item
  2. soldered down 1 item
  3. CFAST slot 1 item
  4. I2C EEPROM 1 item
  5. M.2 NVMe SSD slot 3 items
  6. microSD card slot 4 items
  7. onboard eMMC 26 items
  8. onboard eMMC 3 items
  9. SATA channels ≥ 1 18 items
  10. SATA channels ≥ 1 1 item
  11. SATA channels ≥ 2 3 items
  12. SATA channels ≥ 2 13 items
  13. SATA channels ≥ 3 1 item
  14. SD interface 12 items
  15. SD interface 2 items
  16. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 item
  17. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 2 items
Operating Temperature
  1. -20°C ÷ +60°C 3 items
  2. -40°C ÷ +85°C 4 items
  3. 0°C ÷ +50°C 3 items
  4. 0°C ÷ +60°C 4 items
  5. 20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 3 items
  2. PCI-e lanes ≥ 2 1 item
  3. PCI-e lanes ≥ 3 1 item
  4. PCI-e lanes ≥ 4 2 items
Ttl Uarts
  1. TTL Uarts ≥1 3 items
  2. TTL Uarts ≥2 4 items
USB
  1. USB 2.0 ≥ 1 4 items
  2. USB 2.0 ≥ 2 3 items
  3. USB 2.0 ≥ 3 3 items
  4. USB 2.0 ≥ 4 3 items
  5. USB 2.0 ≥ 5 2 items
  6. USB 2.0 ≥ 6 1 item
  7. USB 3.0 ≥ 1 2 items
  8. USB 3.0 ≥ 2 1 item
  9. USB 3.0 ≥ 3 1 item
  10. USB 3.0 ≥ 4 1 item
  11. USB CLIENT 1 item
  12. USB OTG 2 items
Video Interfaces
  1. DDI 1 item
  2. DP 3 items
  3. DUAL CHANNEL LVDS 2 items
  4. eDP 3 items
  5. HDMI 4 items
  6. MIPI-CSI camera conn 1 item
  7. SINGLE CHANNEL LVDS 3 items
  8. VGA 1 item
Wireless Connectivity
  1. ONBOARD WI-FI/BLE 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®