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COM Express®
COM-HPC®
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今購入中：
  1. Mass Storage
    SD interface
  2. Operating Temperature
    -20°C ÷ +60°C
  3. USB
    USB 2.0 ≥ 5
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Shopping Options
Cpu Maker
  1. Intel 1 item
  2. NXP 1 item
Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range < 10 W 2 items
Cpu Type
  1. Intel® Atom™ 1 item
  2. Intel® Celeron® 1 item
  3. Intel® Pentium® 1 item
  4. NXP i.MX 8M Mini 1 item
  5. NXP i.MX 8M Nano 1 item
Ethernet
  1. ETHERNET≥1 2 items
  2. ETHERNET≥2 1 item
Form Factor
  1. Qseven 1 item
  2. SMARC 1 item
Form Factor Dimensions
  1. 40x70 mm (µQseven, 1.57"x 2.76") 1 item
  2. ≤ 100 x 100mm 2 items
  3. ≤ 80 x 80mm 2 items
Form Factor Specification
  1. µQseven 70x40 1 item
Memory
  1. memory ≤1 2 items
  2. memory ≤2 2 items
  3. memory ≤4 2 items
  4. memory ≤8 1 item
  5. soldered down 2 items
Mass Storage
  1. microSD card slot 2 items
  2. onboard eMMC 10 items
  3. onboard eMMC 2 items
  4. SATA channels ≥ 1 10 items
  5. SATA channels ≥ 2 8 items
  6. SD interface 2 items
  7. SD interface 1 item
Operating Temperature
  1. -20°C ÷ +60°C 2 items
  2. -40°C ÷ +85°C 2 items
  3. 0°C ÷ +50°C 4 items
  4. 0°C ÷ +60°C 4 items
  5. 20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 1 item
  3. PCI-e lanes ≥ 3 1 item
  4. PCI-e lanes ≥ 4 1 item
Ttl Uarts
  1. TTL Uarts ≥1 2 items
  2. TTL Uarts ≥2 2 items
  3. TTL Uarts ≥3 1 item
USB
  1. USB 2.0 ≥ 1 8 items
  2. USB 2.0 ≥ 2 8 items
  3. USB 2.0 ≥ 3 7 items
  4. USB 2.0 ≥ 4 5 items
  5. USB 2.0 ≥ 5 2 items
  6. USB 2.0 ≥ 6 1 item
  7. USB 3.0 ≥ 1 5 items
  8. USB 3.0 ≥ 2 4 items
  9. USB OTG 5 items
Video Interfaces
  1. DP++ 1 item
  2. DUAL CHANNEL LVDS 2 items
  3. eDP 2 items
  4. HDMI 1 item
  5. MIPI-CSI camera conn 1 item
  6. MIPI-DSI 1 item
  7. SINGLE CHANNEL LVDS 2 items
Wireless Connectivity
  1. ONBOARD WI-FI/BLE 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®