Menu
Account
Computer on Module
COM Express®
COM-HPC®
Qseven®
SMARC®
Myon MicroModule (SOM)
Trizeps SODIMM (SOM)
ETX®

Computer on Module

Shop By
Clear All

2 Items

Set Descending Direction
per page
Shop By
今購入中：
  1. Memory
    soldered down
  2. Mass Storage
    SATA channels ≥ 2
  3. Ttl Uarts
    TTL Uarts ≥2
Clear All
Shopping Options
Cpu Maker
  1. Intel 1 item
  2. Qualcomm 1 item
Cpu Power Consumption
  1. range < 10 W 1 item
Cpu Type
  1. Intel® Atom™ 1 item
  2. Intel® Celeron® 1 item
  3. Intel® Pentium® 1 item
  4. Qualcomm Dragonwing IQ9 1 item
Ethernet
  1. ETHERNET≥1 1 item
  2. ETHERNET≥2 1 item
Form Factor
  1. COM-HPC® 1 item
  2. Qseven 1 item
Form Factor Dimensions
  1. ≤ 80 x 80mm 1 item
Form Factor Specification
  1. Qseven 70x70 mm 1 item
Memory
  1. memory ≤1 13 items
  2. memory ≤16 12 items
  3. memory ≤2 12 items
  4. memory ≤4 13 items
  5. memory ≤8 13 items
  6. memory ≥32 9 items
  7. soldered down 2 items
  8. SO_DIMM 12 items
Mass Storage
  1. onboard SSD 1 item
  2. soldered down 1 item
  3. M.2 NVMe SSD slot 1 item
  4. microSD card slot 2 items
  5. onboard eMMC 13 items
  6. onboard eMMC 3 items
  7. SATA channels ≥ 1 6 items
  8. SATA channels ≥ 2 2 items
  9. SD interface 8 items
  10. SD interface 2 items
  11. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -40°C ÷ +85°C 2 items
  2. 0°C ÷ +60°C 2 items
Pci Express
  1. PCI-e lanes ≥ 4 1 item
  2. PCI-e lanes ≥ 5 1 item
Ttl Uarts
  1. TTL Uarts ≥1 2 items
  2. TTL Uarts ≥2 2 items
USB
  1. USB 2.0 ≥ 4 1 item
  2. USB 2.0 ≥ 6 1 item
  3. USB 3.2 ≥ 2 1 item
Video Interfaces
  1. DDI 1 item
  2. DP 1 item
  3. DP++ 1 item
  4. eDP 2 items
  5. MIPI-CSI camera conn 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®