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COM Express®
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今購入中：
  1. Memory
    soldered down
  2. Mass Storage
    SATA channels ≥ 2
  3. Pci Express
    PCI-e lanes ≥ 5
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Cpu Maker
  1. Intel 1 item
  2. Qualcomm 1 item
Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range < 10 W 1 item
Cpu Type
  1. Intel® Core™ 1 item
  2. Intel® Pentium® 1 item
  3. Qualcomm Dragonwing IQ9 1 item
Ethernet
  1. ETHERNET≥2 1 item
Form Factor
  1. COM Express® 1 item
  2. COM-HPC® 1 item
Form Factor Dimensions
  1. ≥ 100 x 100mm 1 item
Form Factor Specification
  1. COM Express Basic 1 item
Memory
  1. memory ≤1 12 items
  2. memory ≤16 13 items
  3. memory ≤2 12 items
  4. memory ≤4 13 items
  5. memory ≤8 13 items
  6. memory ≥32 12 items
  7. soldered down 2 items
  8. SO_DIMM 13 items
Mass Storage
  1. soldered down 1 item
  2. CFAST slot 1 item
  3. M.2 NVMe SSD slot 1 item
  4. SATA channels ≥ 1 1 item
  5. SATA channels ≥ 2 2 items
  6. SATA channels ≥ 3 1 item
  7. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -40°C ÷ +85°C 2 items
  2. 0°C ÷ +50°C 1 item
  3. 0°C ÷ +60°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 2 items
  3. PCI-e lanes ≥ 3 2 items
  4. PCI-e lanes ≥ 4 3 items
  5. PCI-e lanes ≥ 5 2 items
Ttl Uarts
  1. TTL Uarts ≥1 1 item
  2. TTL Uarts ≥2 1 item
USB
  1. USB 2.0 ≥ 1 1 item
  2. USB 2.0 ≥ 2 1 item
  3. USB 2.0 ≥ 3 1 item
  4. USB 2.0 ≥ 4 2 items
  5. USB 2.0 ≥ 5 1 item
  6. USB 3.0 ≥ 1 1 item
  7. USB 3.0 ≥ 2 1 item
  8. USB 3.0 ≥ 3 1 item
  9. USB 3.1 ≥ 1 1 item
  10. USB 3.1 ≥ 2 1 item
  11. USB CLIENT 1 item
  12. USB OTG 1 item
Video Interfaces
  1. DDI 1 item
  2. DP 1 item
  3. DP++ 1 item
  4. DUAL CHANNEL LVDS 1 item
  5. eDP 2 items
  6. HDMI 1 item
  7. MIPI-CSI camera conn 1 item
  8. PARALLEL RGB 1 item
  9. SINGLE CHANNEL LVDS 1 item
  10. VGA 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®