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COM Express®
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SMARC®
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今購入中：
  1. Ethernet
    ETHERNET≥1
  2. USB
    USB OTG
  3. Video Interfaces
    eDP
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Shopping Options
Cpu Maker
  1. Intel 2 items
  2. NXP 1 item
Cpu Power Consumption
  1. range < 10 W 1 item
Cpu Type
  1. Intel® Core™ 2 items
  2. NXP i.MX 8M 1 item
Ethernet
  1. ETHERNET≥1 3 items
  2. ETHERNET≥2 1 item
Form Factor
  1. COM Express® 2 items
  2. Qseven 1 item
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 2 items
  2. ≤ 100 x 100mm 1 item
  3. ≤ 80 x 80mm 1 item
Form Factor Specification
  1. COM Express Basic 2 items
  2. Qseven 70x70 mm 1 item
Memory
  1. memory ≤1 1 item
  2. memory ≤2 1 item
  3. memory ≤4 1 item
  4. memory ≥32 2 items
  5. soldered down 1 item
Mass Storage
  1. M.2 SATA SSD slot 2 items
  2. microSD card slot 1 item
  3. onboard eMMC 1 item
  4. SATA channels ≥ 2 1 item
  5. SATA channels ≥ 2 1 item
Operating Temperature
  1. -20°C ÷ +60°C 1 item
  2. -40°C ÷ +85°C 1 item
  3. 0°C ÷ +50°C 1 item
  4. 0°C ÷ +60°C 3 items
  5. 20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 1 item
  2. PCI-e lanes ≥ 5 2 items
Ttl Uarts
  1. TTL Uarts ≥1 1 item
  2. TTL Uarts ≥2 1 item
USB
  1. USB 2.0 ≥ 1 22 items
  2. USB 2.0 ≥ 2 21 items
  3. USB 2.0 ≥ 3 21 items
  4. USB 2.0 ≥ 4 21 items
  5. USB 2.0 ≥ 5 19 items
  6. USB 2.0 ≥ 6 21 items
  7. USB 3.0 ≥ 1 11 items
  8. USB 3.0 ≥ 2 10 items
  9. USB 3.0 ≥ 3 8 items
  10. USB 3.0 ≥ 4 7 items
  11. USB 3.1 ≥ 1 9 items
  12. USB 3.1 ≥ 2 6 items
  13. USB 3.2 ≥ 1 4 items
  14. USB 3.2 ≥ 2 6 items
  15. USB 4.0 ≥ 1 1 item
  16. USB 4.0 ≥ 2 4 items
  17. USB CLIENT 1 item
  18. USB OTG 3 items
Video Interfaces
  1. DDI 2 items
  2. DP 3 items
  3. DUAL CHANNEL LVDS 9 items
  4. eDP 3 items
  5. HDMI 8 items
  6. MIPI-CSI camera conn 5 items
  7. MIPI-DSI 4 items
  8. SINGLE CHANNEL LVDS 9 items
Wireless Connectivity
  1. ONBOARD WI-FI/BLE 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®