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COM-HPC Development Kit
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Cpu Maker
  1. Qualcomm 1 item
Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range < 10 W 1 item
  3. range < 5 W 1 item
  4. range > 25 W 1 item
Cpu Type
  1. Qualcomm® QCS6490 1 item
Ethernet
  1. ETHERNET≥1 1 item
  2. ETHERNET≥2 2 items
Form Factor
  1. Myon MicroModule SOM 1 item
  2. SMARC 1 item
  3. Trizeps SODIMM SOM 2 items
Form Factor Dimensions
  1. ≥ 100 x 100mm 1 item
Memory
  1. soldered down 1 item
Mass Storage
  1. onboard eMMC 1 item
  2. SATA channels ≥ 1 1 item
  3. SATA channels ≥ 2 1 item
  4. SD interface 1 item
Operating Temperature
  1. -40°C ÷ +85°C 2 items
  2. 0°C ÷ +50°C 1 item
  3. 0°C ÷ +60°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 1 item
  2. PCI-e lanes ≥ 2 1 item
  3. PCI-e lanes ≥ 3 1 item
  4. PCI-e lanes ≥ 4 1 item
  5. PCI-e lanes ≥ 5 1 item
Ttl Uarts
  1. TTL Uarts ≥3 1 item
USB
  1. USB 2.0 ≥ 1 3 items
  2. USB 2.0 ≥ 2 1 item
  3. USB 2.0 ≥ 3 1 item
  4. USB 2.0 ≥ 4 1 item
  5. USB 3.1 ≥ 1 1 item
  6. USB 4.0 ≥ 1 1 item
  7. USB 4.0 ≥ 2 1 item
  8. USB 4.0 ≥ 3 1 item
  9. USB 4.0 ≥ 4 1 item
  10. USB CLIENT 1 item
Video Interfaces
  1. DP 1 item
  2. DP++ 1 item
  3. MIPI-CSI camera conn 1 item
  4. MIPI-DSI 1 item
  5. SINGLE CHANNEL LVDS 1 item
Wireless Connectivity
  1. ONBOARD WI-FI/BLE 1 item
Starter and Development Kits
  • COM-HPC Development Kit
  • COM Express Starter Kit
  • Myon Development Kit
  • Qseven Starter Kit
  • SMARC Development Kit
  • Trizeps Development Kit