SOM-Q7-MX8M (sample)

Modulo Qseven® Rel. 2.1 con Processori NXP i.MX 8 (Formerly MAIA)

Disponibile nell'intervallo di temperatura industriale

Data sheet

Contattaci per maggiori informazioni e per preventivi

Contattaci

Cpu

NXP i.MX 8 Applications Processors

Grafica

Integrated GPU, supports 2 independent displays

Connettività

1x USB 3.0; PCI-e x1 Gen3; CSI camera connector; Boot select signal

Memoria

soldered down LPDDR4-3200 memory

Dettagli Prodotto

Informazioni tecniche

Descrizione	MAIA is a Qseven® Rel. 2.1 compliant module based on the NXP i.MX 8 Applications Processors. This solution features rich m2m interface to control onboard subsystems and wide connectivity, taking advantage of the wide scalability offered by Qseven® form factor and the i.MX 8 family.
Cpu	NXP i.MX 8 Family: i.MX 8QuadMax - 2x Cortex®-A72 cores @1.6GHz + 4x Cortex®-A53 cores @1.2GHz + 2x Cortex®-M4F cores @264MHz i.MX 8QuadPlus - 1x Cortex®-A72 cores @1.6GHz + 4x Cortex®-A53 cores @1.2GHz + 2x Cortex®-M4F cores @264MHz
Memoria	soldered down LPDDR4-3200 memory, 64-bit interface, up to 8GB
Grafica	Integrated Graphics Processing Unit, supports 2 independent displays. Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264, MPEG-2, VC-1, RV9, VP8, H.263 and MPEG4 part, HW encoding of AVC/H.264 Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 3.x, DirectX 11
Interfacce video	HDMI 2.0a / DP 1.3 or eDP 1.4 interface, supporting HDCP 2.2 Dual Channel or 2 x Single Channel 18- / 24-bit LVDS interface (1 x Single Channel in case of eDP interface available)
Risoluzione video	HDMI / DP / eDP resolution up to 4096x2160 @ 60Hz LVDS resolution up to 1920x1080 @ 60Hz
Memoria di massa	1x SATA Gen3 interface eMMC 5.1 drive soldered on-board SD 4-bit interface QSPI Flash soldered-on-board
Rete	1 x Gigabit Ethernet interface
USB	4 x USB 2.0 Host Ports 1 x USB 3.0 Host Port 1 x USB 2.0 OTG port
Pci	2x PCI-e x1 Gen3 ports
Audio	I2S Audio Interface
Porte seriali	1x UART Tx/Rx/RTS/CTS 1x CAN Bus (TTL level)
Altre interfacce	CSI camera connector 2x I2C Bus SPI interface 8 x GPI/Os Boot select signal Power Management Signals Watchdog
Dispositivo di alimentazione	+5VDC ± 5% +3.3V_RTC
Sistema operativo	Linux Yocto Android
Temperatura operativa	0°C ÷ +60°C (Commercial version) -40°C ÷ +85°C (Industrial version) *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensioni	70x70 mm (2.76” x 2.76”)