SOM-SMARC-ADL-N

SMARC® Rel. 2.1 compliant Computer on Module (CoM) with Intel® Atom® processors x7000E Series, Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Alder Lake N). (FINLAY - E08)

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Cpu

Intel® Atom® processors x7000E Series, Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Alder Lake N) targeted for IoT and multimedia applications

Graphiques

Integrated Intel® UHD Graphics driven by Intel® Xe architecture, supporting 3 independent displays each up to 4K resolution

Connectivité

2 x NBase-T (2.5GbE supported); 2x USB 3.2 Gen 2; 6x USB 2.0; 4x PCI-e Gen3 lanes with optional SERDES

Mémoire

Quad Channel LPDDR5 soldered down with IBECC

Détails produit

Info technique

Description	SMARC® Rel. 2.1 compliant Computer on Module (CoM) with Intel® Atom® processors x7000E Series, Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Alder Lake N)
Cpu	Intel® Atom® processors x7000E Series, Intel® Core™ i3 processor and Intel® Processors N Series (Codename: Alder Lake N): · Intel® Atom® x7213E, 2 Cores @1.7 GHz (3.2 GHz Turbo), 10W TDP, with TSN and TCC* · Intel® Atom® x7425E, 4 Cores @1.5 GHz (3.4 GHz Turbo), 12W TDP, with TSN and TCC* · Intel® Atom® x7211E, 2 Cores @1.0 GHz (3.2 GHz Turbo), 6W TDP, with TSN and TCC* · Intel® Core™ i3-N305, 8 Cores @1.8 GHz (3.8 GHz Turbo), 15W TDP · Intel® Processor N200, 4 Cores @1.0 GHz (3.7 GHz Turbo), 6W TDP · Intel® Processor N97, 4 Cores @2.0 GHz (3.6 GHz Turbo), 12W TDP · Intel® Processor N50, 2 Cores @1 GHz (3.4 GHz Turbo), 6W TDP * Time Sensitive Network and Time Coordinate Computing
Mémoire	Up to 16GB LPDDR5-4800 soldered down memory with IBECC (in-band error correction code)
Graphiques	Integrated Intel® UHD Graphics driven by Intel® Xe architecture: Intel® Atom® x7213E processors with 16 Execution Units Intel® Atom® x7425E processors with 24 Execution Units Intel® Atom® x7211E processors with 16 Execution Units Intel® Core™ i3-N305 processors with 32 Execution Units Intel® Processor N200 with 32 Execution Units Intel® Processor N97 with 24 Execution Units Intel® Processor N50 with 16 Execution Units AVX256 & VNNI support for faster AI inference and media transcoding Support with up to 3 independent 4K60 SDR displays
Interfaces vidéo	Integrated Intel® UHD Graphics driven by Intel® Xe architecture, supporting 3 independent displays each up to 4K resolution
Résolution vidéo	Up to 4096x2160 @60Hz
Stockage masse	1x external S-ATA Gen3.2 channel Optional eMMC 5.1 drive soldered on-board
Réseau	2x NBase-T Ethernet ports (2.5GbE supported) with Time-Sensitive Networking functionality, implemented using as many Intel® i225 Gigabit Ethernet controllers, managed by two integrated PCH PCI-e ports Optional SERDES (SGMII) interface for additional third Gigabit Ethernet (factory option, alternative to fourth PCI-e lane)
Usb	6x USB 2.0 host ports 2x USB 3.2 Gen2 ports
Pci	4x PCIe Gen3 lanes Possible channel aggregations: 4 ports x1 lanes (4x1) 1 port x2 lanes + 2 ports x1 lane (1x2 + 2x1) or SERDES in place of fourth PCIe lane
Audio	HD Audio and Soundwire/i2S Audio interfaces
Ports sériels	2x UARTs 2x HS-UARTs
Autres Interfaces	Up to 14x GPIOs SM bus I2C bus 1x SPI interface for boot 1x General Purpose SPI or eSPI (factory alternatives) Power management signals, watchdog
Alimentation	+5VDC and +3VDC for RTC
Système d’exploitation	Microsoft® Windows 10 Linux Kernel LTS
Température de fonctionnement	0°C to +60°C (Commercial version) * *Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature depends on the application, enclosure, and/or environment. It is the customer’s responsibility to implement an application-specific cooling solution for the customer’s system that keeps the heat spreader temperature in the range indicated.
Dimensions	50 x 82 mm

Documentation

Data Sheet	[Datasheet] SOM-SMARC-ADL-N Rel 1.0
Image	[Picture] SOM-SMARC-ADL-N front scont [Picture] SOM-SMARC-ADL-N back scont

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