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SOM-COMe-CT6-MBPF [Discontinued]
COM Express® Compact Type 6 Computer on Module (CoM) avec système sur puce embarqué AMD série R de 3e génération (Codename: Merlin Falcon) ou système sur puce série G de la famille I (Codename: Brown Falcon) ou système sur puce série G de la famille J (Codename: Prairie Falcon) .
(AMOS - A98)
Available in Industrial Temperature Range
Cpu
AMD Embedded 3rd generation R-Series SOC, G-Series SOC-I or G-Series SoC-J
Graphiques
AMD Radeon 3rd -Generation Graphics Core Next (GCN)
Connectivité
4x USB 3.0; 8x USB 2.0; 3x PCI-e x1 Gen3
Mémoire
Two SO-DIMM slots supporting DDR4 ECC and non-ECC modules
Détails produit
Description
|
SOM-COMe-CT6-MBPF is a COM Express® Compact Type 6 Computer on Module (CoM) with the AMD Embedded 3rd generation R-Series SoC (formerly Merlin Falcon), G-Series SoC-I (formerly Brown Falcon) or G-Series SoC-J (formerly Prairie Falcon) designed by SECO that features up to 4 Excavator x86 CPU cores with the latest Radeon graphics and I / O Controller on a single Chip; each Processor can scale the TDP down to 15W. SOM-COMe-CT6-MBPF is ideal in applications where scalable graphics performance makes the difference. |
|---|---|
Cpu
|
AMD RX-421BD, Quad Core @ 2.1 GHz (3.4 GHz Max), TDP 35W AMD GX-224IJ, Dual Core @ 2.4GHz (2.8GHz Max), cTDP 10-15W |
|
Cores max
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4 |
|
Mémoire
|
R-Series: Two SO-DIMM slots supporting DDR4 ECC / nonECC modules up to 2133MHz G-Series SoC-I: Two SO-DIMM slots supporting DDR4 ECC / non-ECC modules up to 1600MHz G-Series SoC-J: One SO-DIMM slot supporting DDR4 nonECC modules up to 2133MHz |
|
Graphiques
|
AMD Radeon 3rd -Generation Graphics Core Next (GCN) |
Interfaces vidéo
|
Up to 3 x Digital Display Interfaces (DDIs), supporting eDP1.4, DP 1.2, DVI and HDMI 1.4b/2.0 (up to 2x DDIs with G-Series SoC-I and SoC-J) |
Résolution vidéo
|
DDIs: up to 4K |
Stockage masse
|
2 x SATA Gen3 Channels |
Réseau
|
Gigabit Ethernet interface |
Usb
|
4 x USB 3.0 Host ports |
|
Pci
|
3 x PCI-e x 1 lanes |
Audio
|
HD Audio Interface |
Ports sériels
|
2 x HS UARTs |
Autres Interfaces
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SPI, I2C Bus, SM Bus, LPC Bus, 2 x Express Card, FAN management |
Alimentation
|
+12VDC ± 10% and + 5VSB (optional) |
Système d’exploitation
|
Microsoft® Windows 7 |
Température de fonctionnement
|
0°C ÷ +60 °C (Commercial version) *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
Dimensions
|
95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout) |
Accessories
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