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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)

UDOO x86 II

UDOO x86 II

SBC basé sur le processeur Intel® Celeron® et Pentium®

UDOO VISION

UDOO VISION

Ordinateur monocarte Pico-ITX avec processeurs Intel® Atom® série X, Intel® Celeron® série N, Intel® Pentium® série N (codename: Apollo Lake)

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Ordinateur embarqué sans ventilateur avec les processeurs Intel® Core™ de 11ème génération et les SoCs Intel® Celeron® (Codename: Tiger Lake UP3) ainsi que la puce d'IA Axelera : alimenté par un seul Metis AIPU jusqu'à 120 TOPS

Processeur Intel

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    Single Board Computer
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Cpu Power Consumption
  1. range 10-25 W 2 items
  2. range < 10 W 3 items
Cpu Type
  1. Intel® Atom™ 3 items
  2. Intel® Celeron® 2 items
  3. Intel® Pentium® 2 items
Ethernet
  1. ETHERNET≥1 3 items
  2. ETHERNET≥2 2 items
Form Factor
  1. COM Express® 12 items
  2. COM-HPC® 5 items
  3. Qseven 3 items
  4. Single Board Compute 1 item
  5. SMARC 3 items
  6. Single Board Computer 1 item
  7. Single Board Computer 3 items
Form Factor Dimensions
  1. ≤ 100 x 100mm 2 items
  2. ≥ 100 x 100mm 1 item
Form Factor Specification
  1. embedded NUC 1 item
  2. Pico-ITX 2 items
Memory
  1. memory ≤1 3 items
  2. memory ≤16 1 item
  3. memory ≤2 3 items
  4. memory ≤4 3 items
  5. memory ≤8 3 items
  6. soldered down 2 items
  7. SO_DIMM 1 item
Mass Storage
  1. mSATA half-size slot 1 item
  2. onboard SSD 2 items
  3. standard SATA connector 2 items
  4. M.2 SATA SSD slot 2 items
  5. microSD card slot 2 items
  6. onboard eMMC 1 item
  7. onboard eMMC 1 item
  8. SATA channels ≥ 1 3 items
  9. SATA channels ≥ 2 1 item
Operating Temperature
  1. -20°C ÷ +60°C 3 items
  2. -40°C ÷ +85°C 3 items
  3. 0°C ÷ +50°C 3 items
  4. 0°C ÷ +60°C 3 items
  5. 20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 1 item
  2. PCI-e lanes ≥ 2 1 item
  3. PCI-e lanes ≥ 3 1 item
USB
  1. USB 2.0 ≥ 1 3 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 1 item
  5. USB 2.0 ≥ 5 1 item
  6. USB 3.0 ≥ 1 3 items
  7. USB 3.0 ≥ 2 3 items
  8. USB 3.0 ≥ 3 1 item
Video Interfaces
  1. DP 1 item
  2. DP++ 5 items
  3. DUAL CHANNEL LVDS 4 items
  4. eDP 2 items
  5. HDMI 3 items
  6. SINGLE CHANNEL LVDS 4 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
  2. M.2 Socket 2 key B 2 items