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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)

UDOO x86 II

UDOO x86 II

SBC basé sur le processeur Intel® Celeron® et Pentium®

UDOO VISION

UDOO VISION

Ordinateur monocarte Pico-ITX avec processeurs Intel® Atom® série X, Intel® Celeron® série N, Intel® Pentium® série N (codename: Apollo Lake)

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Ordinateur embarqué sans ventilateur avec les processeurs Intel® Core™ de 11ème génération et les SoCs Intel® Celeron® (Codename: Tiger Lake UP3) ainsi que la puce d'IA Axelera : alimenté par un seul Metis AIPU jusqu'à 120 TOPS

Processeur Intel

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  1. Cpu Type
    Intel® Celeron®
  2. Memory
    soldered down
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Cpu Power Consumption
  1. range 10-25 W 8 items
  2. range < 10 W 11 items
Cpu Type
  1. Intel® Atom™ 16 items
  2. Intel® Celeron® 14 items
  3. Intel® Core™ 3 items
  4. Intel® Pentium® 12 items
Ethernet
  1. ETHERNET≥1 13 items
  2. ETHERNET≥2 7 items
Form Factor
  1. Qseven 5 items
  2. Single Board Compute 1 item
  3. SMARC 2 items
  4. Boxed Solutions 2 items
  5. Single Board Computer 1 item
  6. Single Board Computer 3 items
Form Factor Dimensions
  1. 40x70 mm (µQseven, 1.57"x 2.76") 1 item
  2. ≤ 100 x 100mm 9 items
  3. ≤ 80 x 80mm 7 items
  4. ≥ 100 x 100mm 2 items
Form Factor Specification
  1. embedded NUC 1 item
  2. Other SBCs 2 items
  3. Pico-ITX 2 items
  4. Qseven 70x70 mm 4 items
  5. µQseven 70x40 1 item
Memory
  1. memory ≤1 16 items
  2. memory ≤16 8 items
  3. memory ≤2 17 items
  4. memory ≤4 17 items
  5. memory ≤8 19 items
  6. memory ≥32 6 items
  7. soldered down 14 items
  8. SO_DIMM 9 items
Mass Storage
  1. onboard SSD 3 items
  2. standard SATA connector 4 items
  3. M.2 SATA SSD slot 6 items
  4. microSD card slot 3 items
  5. onboard eMMC 2 items
  6. onboard eMMC 10 items
  7. SATA channels ≥ 1 9 items
  8. SATA channels ≥ 2 5 items
  9. SD interface 6 items
Operating Temperature
  1. -20°C ÷ +60°C 6 items
  2. -40°C ÷ +85°C 9 items
  3. 0°C ÷ +50°C 10 items
  4. 0°C ÷ +60°C 13 items
  5. 20°C ÷ +70°C 7 items
Pci Express
  1. PCI-e lanes ≥ 1 7 items
  2. PCI-e lanes ≥ 2 7 items
  3. PCI-e lanes ≥ 3 7 items
  4. PCI-e lanes ≥ 4 4 items
Ttl Uarts
  1. TTL Uarts ≥1 6 items
  2. TTL Uarts ≥2 7 items
  3. TTL Uarts ≥3 1 item
USB
  1. USB 2.0 ≥ 1 9 items
  2. USB 2.0 ≥ 2 9 items
  3. USB 2.0 ≥ 3 7 items
  4. USB 2.0 ≥ 4 7 items
  5. USB 2.0 ≥ 5 6 items
  6. USB 2.0 ≥ 6 6 items
  7. USB 3.0 ≥ 1 7 items
  8. USB 3.0 ≥ 2 4 items
  9. USB 3.0 ≥ 3 3 items
  10. USB 3.1 ≥ 1 1 item
  11. USB 3.1 ≥ 2 1 item
  12. USB 3.2 ≥ 2 3 items
Video Interfaces
  1. DP 3 items
  2. DP++ 12 items
  3. DUAL CHANNEL LVDS 7 items
  4. eDP 8 items
  5. HDMI 9 items
  6. MIPI-CSI camera conn 2 items
  7. MIPI-DSI 1 item
  8. SINGLE CHANNEL LVDS 7 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 5 items
  2. M.2 SOCKET 2 KEY 3 items
  3. M.2 Socket 2 key B 3 items