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SMARC®

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SOM-SMARC-MX952

SOM-SMARC-MX952

SMARC® Rel. 2.1.1 module with NXP i.MX 952 Applications Processor
SOM-SMARC-Dragonwing-IQ8

SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.2 module with Qualcomm Dragonwing™ IQ8 Applications Processors. (F86)

SOM-SMARC-ZU

SOM-SMARC-ZU

Module SMARC® vers. 2.0 avec système sur puce multiprocesseur Zynq® Ultrascale+™. (RUSSELL - B71)

SOM-SMARC-TWL

SOM-SMARC-TWL

SMARC® Rel. 2.1 compliant module with Intel® Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Twin Lake). (E08)

SOM-SMARC-QCS6490

SOM-SMARC-QCS6490

SMARC® 2.1.1 module powered by Qualcomm Dragonwing™ QCS6490 processor. (E81)

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  1. USB
    USB 2.0 ≥ 4
  2. Video Interfaces
    HDMI
  3. Wireless Connectivity
    M.2 SOCKET 1 KEY
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Cpu Maker
  1. MediaTek 1 item
  2. NXP 1 item
Cpu Type
  1. MediaTek Genio 510 1 item
  2. NXP i.MX 952 1 item
Ethernet
  1. ETHERNET≥1 2 items
  2. ETHERNET≥2 1 item
Form Factor Specification
  1. ≤ 100 x 100mm 1 item
Memory
  1. memory ≤1 2 items
  2. memory ≤16 1 item
  3. memory ≤2 2 items
  4. memory ≤4 2 items
  5. memory ≤8 2 items
  6. soldered down 1 item
Mass Storage
  1. onboard eMMC 1 item
  2. onboard eMMC 1 item
  3. SD interface 1 item
Operating Temperature
  1. -20°C ÷ +60°C 2 items
  2. -20°C ÷ +70°C 1 item
  3. -40°C ÷ +85°C 2 items
  4. 0°C ÷ +50°C 2 items
  5. 0°C ÷ +60°C 2 items
  6. 20°C ÷ +70°C 2 items
  7. -20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 1 item
  2. PCI-e lanes ≥ 2 1 item
Ttl Uarts
  1. TTL Uarts ≥1 2 items
  2. TTL Uarts ≥2 2 items
  3. TTL Uarts ≥3 2 items
USB
  1. USB 2.0 ≥ 1 2 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 2 items
  5. USB 2.0 ≥ 5 2 items
  6. USB 2.0 ≥ 6 1 item
  7. USB 3.1 ≥ 1 1 item
  8. USB OTG 1 item
Video Interfaces
  1. DP 3 items
  2. DUAL CHANNEL LVDS 3 items
  3. eDP 3 items
  4. HDMI 2 items
  5. MIPI-CSI camera conn 2 items
  6. MIPI-DSI 2 items
  7. SINGLE CHANNEL LVDS 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 items