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SOM-SMARC-MX952

SOM-SMARC-MX952

SMARC® Rel. 2.1.1 module with NXP i.MX 952 Applications Processor
SOM-SMARC-Dragonwing-IQ8

SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.2 module with Qualcomm Dragonwing™ IQ8 Applications Processors. (F86)

/images/trizeps/som-trizeps-x-genio-front-main.jpg

SOM-Trizeps-X-Genio360

SODIMM-200 CPU Computer on Module with MediaTek Genio 360 Applications Processor. (F67)

/images/hmi/modular-vision-front-main-10-1.jpg

Modular Vision 10.1 MX95

Entry level 10.1 inch HMI based on NXP i.MX95

/images/com_express/SOM-COMe-CT6-Dragonwing-X_front.jpg

SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)

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  1. Operating Temperature
    -20°C ÷ +70°C
  2. Video Interfaces
    MIPI-CSI camera conn
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Shopping Options
Cpu Maker
  1. NXP 1 item
  2. Qualcomm 1 item
Cpu Type
  1. NXP i.MX 95 1 item
  2. Qualcomm® QCS5430 1 item
Ethernet
  1. ETHERNET≥1 2 items
  2. ETHERNET≥2 2 items
Form Factor Specification
  1. ≤ 100 x 100mm 1 item
Memory
  1. memory ≤1 2 items
  2. memory ≤16 1 item
  3. memory ≤2 2 items
  4. memory ≤4 2 items
  5. memory ≤8 2 items
  6. soldered down 1 item
Mass Storage
  1. onboard eMMC 2 items
  2. SD interface 2 items
Operating Temperature
  1. -20°C ÷ +60°C 5 items
  2. -40°C ÷ +85°C 5 items
  3. 0°C ÷ +50°C 6 items
  4. 0°C ÷ +60°C 7 items
  5. 20°C ÷ +70°C 5 items
  6. -20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 2 items
Ttl Uarts
  1. TTL Uarts ≥1 2 items
  2. TTL Uarts ≥2 2 items
  3. TTL Uarts ≥3 1 item
USB
  1. USB 2.0 ≥ 1 2 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 2 items
  5. USB 2.0 ≥ 5 1 item
  6. USB 2.0 ≥ 6 1 item
  7. USB 3.1 ≥ 1 1 item
  8. USB OTG 1 item
Video Interfaces
  1. DP 2 items
  2. DUAL CHANNEL LVDS 2 items
  3. eDP 2 items
  4. HDMI 1 item
  5. MIPI-CSI camera conn 2 items
  6. MIPI-DSI 2 items
  7. SINGLE CHANNEL LVDS 1 item