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SOM-SMARC-Dragonwing-IQ8

SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm Dragonwing™ IQ8 Applications Processors. (F86)

/images/trizeps/som-trizeps-x-genio-front-main.jpg

SOM-Trizeps-X-Genio360

SODIMM-200 CPU Computer on Module with MediaTek Genio 360 Applications Processor. (F67)

/images/hmi/modular-vision-front-main-10-1.jpg

Modular Vision 10.1 MX95

Entry level 10.1 inch HMI based on NXP i.MX95

/images/com_express/SOM-COMe-CT6-Dragonwing-X_front.jpg

SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)

Titan 225 RK3399

Titan 225 RK3399

Ordinateur embarqué sans ventilateur basé sur le processeur Rockchip RK3399. (PICTOR - SYS-C31-IPC)

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Cpu Type
  1. NXP i.MX 8M Mini 2 items
  2. NXP i.MX 8M Nano 1 item
  3. NXP i.MX6 4 items
  4. NXP i.MX8 1 item
Ethernet
  1. ETHERNET≥1 6 items
  2. ETHERNET≥2 1 item
Form Factor
  1. Modular HMIs 2 items
  2. Single Board Computer 1 item
  3. Single Board Computer 4 items
Form Factor Dimensions
  1. ≥ 100 x 100mm 2 items
Form Factor Specification
  1. 3,5" 6 items
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  3. Other SBCs 7 items
  4. Qseven 70x70 mm 3 items
  5. µQseven 70x40 2 items
InstallationDepth
  1. 35-40 2 items
Memory
  1. memory ≤1 6 items
  2. memory ≤2 1 item
  3. memory ≤4 1 item
  4. memory ≤8 1 item
Mass Storage
  1. microSD card slot 2 items
  2. onboard eMMC 1 item
  3. onboard eMMC 6 items
  4. SD interface 5 items
Operating Temperature
  1. -40°C ÷ +85°C 1 item
  2. 0°C ÷ +50°C 3 items
  3. 0°C ÷ +60°C 6 items
ScreenDimension
  1. 10-14 1 item
  2. 1 item
USB
  1. USB 2.0 ≥ 1 7 items
  2. USB 2.0 ≥ 2 7 items
  3. USB 2.0 ≥ 3 1 item
  4. USB OTG 7 items
Video Interfaces
  1. DUAL CHANNEL LVDS 4 items
  2. HDMI 4 items
  3. MIPI-CSI camera conn 1 item
  4. SINGLE CHANNEL LVDS 4 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
  2. M.2 SOCKET 2 KEY 1 item