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  1. Operating Temperature
    -40°C ÷ +85°C
  2. Pci Express
    PCI-e lanes ≥ 5
  3. Video Interfaces
    MIPI-CSI camera conn
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Cpu Maker
  1. Qualcomm 1 item
Cpu Type
  1. Qualcomm Dragonwing 1 item
Ethernet
  1. ETHERNET≥1 2 items
  2. ETHERNET≥2 1 item
Form Factor
  1. COM Express® 1 item
Form Factor Dimensions
  1. COM Express® 1 item
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  1. COM Express Compact 1 item
Memory
  1. soldered down 1 item
  2. UFS 3.1 module on-board 1 item
  3. I2C EEPROM 1 item
Mass Storage
  1. soldered down 1 item
  2. SATA channels ≥ 1 1 item
  3. SATA channels ≥ 2 1 item
  4. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -40°C ÷ +85°C 2 items
  2. 0°C ÷ +50°C 1 item
  3. 0°C ÷ +60°C 4 items
Pci Express
  1. PCI-e lanes ≥ 1 5 items
  2. PCI-e lanes ≥ 2 4 items
  3. PCI-e lanes ≥ 3 3 items
  4. PCI-e lanes ≥ 4 4 items
  5. PCI-e lanes ≥ 5 2 items
Ttl Uarts
  1. TTL Uarts ≥2 1 item
USB
  1. USB 2.0 ≥ 1 1 item
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  4. USB 2.0 ≥ 4 1 item
  5. USB 2.0 ≥ 6 1 item
  6. USB 3.0 ≥ 4 1 item
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  8. USB 4.0 ≥ 2 1 item
  9. USB 4.0 ≥ 3 1 item
  10. USB 4.0 ≥ 4 1 item
Video Interfaces
  1. DDI 9 items
  2. DP 8 items
  3. DP++ 6 items
  4. DUAL CHANNEL LVDS 10 items
  5. eDP 14 items
  6. HDMI 10 items
  7. MIPI-CSI camera conn 2 items
  8. MIPI-DSI 2 items
  9. PARALLEL RGB 1 item
  10. SINGLE CHANNEL LVDS 10 items
  11. VGA 2 items
Nos Produits
  • Computer on Module
  • Single Board Computer
  • Human Machine Interface
  • Fanless Embedded PCs
  • Industrial Embedded PCs
  • Payment Systems
  • Kits de développement et accessoires
  • AI-Optimized Hardware
  • TFT Display
  • Modular Vision
  • Dev Kits, Carrier Boards and Accessories
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solution