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  1. Operating Temperature
    0°C ÷ +60°C
  2. Pci Express
    PCI-e lanes ≥ 4
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Cpu Maker
  1. AMD 6 items
  2. Intel 19 items
  3. NVIDIA 1 item
  4. Qualcomm 1 item
  5. Rockchip 1 item
Cpu Power Consumption
  1. range 10-25 W 13 items
  2. range < 10 W 8 items
  3. range > 25 W 8 items
Cpu Type
  1. AMD EPYC™ Embedded 3 1 item
  2. AMD Ryzen™ Embedded 3 items
  3. AMD® Ryzen™ embedded 2 items
  4. Intel® Atom™ 9 items
  5. Intel® Celeron® 9 items
  6. Intel® Core™ 12 items
  7. Intel® Pentium® 7 items
  8. Intel® Xeon® 3 items
  9. NVIDIA Tegra® T30 1 item
  10. Rockchip RK3588 1 item
  11. Zynq® Ultras 1 item
  12. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 24 items
  2. ETHERNET≥2 10 items
Form Factor
  1. COM Express® 15 items
  2. COM-HPC® 3 items
  3. Qseven 3 items
  4. SMARC 6 items
  5. Single Board Computer 2 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 2 items
  2. ≤ 100 x 100mm 15 items
  3. ≤ 80 x 80mm 7 items
  4. ≥ 100 x 100mm 5 items
  5. COM Express® 1 item
Form Factor Specification
  1. 3,5" 2 items
  2. COM Express Basic 6 items
  3. COM Express Compact 9 items
  4. COM-HPC Client 3 items
  5. Qseven 70x70 mm 3 items
Memory
  1. memory ≤1 20 items
  2. memory ≤16 16 items
  3. memory ≤2 19 items
  4. memory ≤4 19 items
  5. memory ≤8 19 items
  6. memory ≥32 14 items
  7. soldered down 10 items
  8. SO_DIMM 15 items
  9. memory ≤32 1 item
Mass Storage
  1. CFAST slot 1 item
  2. M.2 NVMe SSD slot 4 items
  3. M.2 SATA SSD slot 1 item
  4. microSD card slot 5 items
  5. onboard eMMC 13 items
  6. onboard eMMC 1 item
  7. SATA channels ≥ 1 21 items
  8. SATA channels ≥ 1 2 items
  9. SATA channels ≥ 2 2 items
  10. SATA channels ≥ 2 16 items
  11. SATA channels ≥ 3 2 items
  12. SATA channels ≥ 4 1 item
  13. SD interface 6 items
  14. SD interface 1 item
  15. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 14 items
  2. -20°C ÷ +70°C 2 items
  3. -40°C ÷ +85°C 26 items
  4. 0°C ÷ +50°C 19 items
  5. 0°C ÷ +60°C 30 items
  6. 20°C ÷ +70°C 14 items
  7. -20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 41 items
  2. PCI-e lanes ≥ 2 33 items
  3. PCI-e lanes ≥ 3 23 items
  4. PCI-e lanes ≥ 4 30 items
  5. PCI-e lanes ≥ 5 22 items
  6. 0°C ÷ +50°C 1 item
  7. 0°C ÷ +60°C 1 item
Ttl Uarts
  1. TTL Uarts ≥1 18 items
  2. TTL Uarts ≥2 20 items
  3. TTL Uarts ≥3 3 items
USB
  1. USB 2.0 ≥ 1 21 items
  2. USB 2.0 ≥ 2 21 items
  3. USB 2.0 ≥ 3 20 items
  4. USB 2.0 ≥ 4 18 items
  5. USB 2.0 ≥ 5 19 items
  6. USB 2.0 ≥ 6 21 items
  7. USB 3.0 ≥ 1 13 items
  8. USB 3.0 ≥ 2 14 items
  9. USB 3.0 ≥ 3 10 items
  10. USB 3.0 ≥ 4 5 items
  11. USB 3.1 ≥ 1 7 items
  12. USB 3.1 ≥ 2 8 items
  13. USB 3.2 ≥ 1 3 items
  14. USB 3.2 ≥ 2 5 items
  15. USB 4.0 ≥ 1 1 item
  16. USB 4.0 ≥ 2 1 item
  17. USB CLIENT 2 items
  18. USB OTG 2 items
Video Interfaces
  1. DDI 11 items
  2. DP 13 items
  3. DP++ 11 items
  4. DUAL CHANNEL LVDS 17 items
  5. eDP 22 items
  6. HDMI 18 items
  7. MIPI-CSI camera conn 5 items
  8. MIPI-DSI 2 items
  9. PARALLEL RGB 1 item
  10. SINGLE CHANNEL LVDS 17 items
  11. VGA 3 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 items
  2. M.2 SOCKET 2 KEY 1 item
  3. M.2 Socket 2 key B 1 item
Nos Produits
  • Computer on Module
  • Single Board Computer
  • Human Machine Interface
  • Fanless Embedded PCs
  • Industrial Embedded PCs
  • Payment Systems
  • Kits de développement et accessoires
  • AI-Optimized Hardware
  • Modular Vision
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solutions