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  1. Form Factor Dimensions
    ≤ 100 x 100mm
  2. USB
    USB 3.0 ≥ 2
  3. Wireless Connectivity
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Cpu Maker
  1. Intel 1 item
  2. NXP 3 items
Cpu Power Consumption
  1. range < 10 W 1 item
Cpu Type
  1. Intel® Atom™ 1 item
  2. NXP i.MX 8M 1 item
  3. NXP i.MX 8M Plus 1 item
  4. NXP i.MX 8X 1 item
Ethernet
  1. ETHERNET≥1 1 item
  2. ETHERNET≥2 3 items
Form Factor
  1. SMARC 3 items
  2. Single Board Computer 1 item
Form Factor Dimensions
  1. ≤ 100 x 100mm 4 items
  2. ≤ 80 x 80mm 3 items
  3. ≥ 100 x 100mm 1 item
Form Factor Specification
  1. Pico-ITX 1 item
Memory
  1. memory ≤1 3 items
  2. memory ≤16 1 item
  3. memory ≤2 3 items
  4. memory ≤4 3 items
  5. soldered down 3 items
Mass Storage
  1. M.2 SATA SSD slot 1 item
  2. onboard eMMC 3 items
  3. SATA channels ≥ 1 1 item
  4. SD interface 3 items
Operating Temperature
  1. -20°C ÷ +60°C 2 items
  2. -40°C ÷ +85°C 4 items
  3. 0°C ÷ +50°C 2 items
  4. 0°C ÷ +60°C 4 items
  5. 20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 3 items
  2. PCI-e lanes ≥ 2 1 item
Ttl Uarts
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  2. TTL Uarts ≥2 2 items
  3. TTL Uarts ≥3 2 items
USB
  1. USB 2.0 ≥ 1 7 items
  2. USB 2.0 ≥ 2 7 items
  3. USB 2.0 ≥ 3 6 items
  4. USB 2.0 ≥ 4 3 items
  5. USB 2.0 ≥ 5 3 items
  6. USB 3.0 ≥ 1 4 items
  7. USB 3.0 ≥ 2 4 items
  8. USB 3.1 ≥ 1 1 item
  9. USB OTG 5 items
Video Interfaces
  1. DUAL CHANNEL LVDS 3 items
  2. eDP 2 items
  3. HDMI 4 items
  4. MIPI-CSI camera conn 1 item
  5. MIPI-DSI 2 items
  6. SINGLE CHANNEL LVDS 4 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
  2. M.2 Socket 2 key B 2 items
  3. ONBOARD WI-FI/BLE 4 items
Nos Produits
  • Computer on Module
  • Single Board Computer
  • Human Machine Interface
  • Fanless Embedded PCs
  • Industrial Embedded PCs
  • Payment Systems
  • Kits de développement et accessoires
  • AI-Optimized Hardware
  • TFT Display
  • Modular Vision
  • Dev Kits, Carrier Boards and Accessories
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solution