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  1. Ethernet
    ETHERNET≥1
  2. Memory
    soldered down
  3. Video Interfaces
    SINGLE CHANNEL LVDS
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Cpu Maker
  1. AMD 1 item
  2. Arm System ready NXP 1 item
  3. Intel 4 items
  4. NVIDIA 1 item
  5. NXP 10 items
  6. Qualcomm 1 item
  7. Rockchip 2 items
Cpu Power Consumption
  1. range 10-25 W 5 items
  2. range < 10 W 17 items
Cpu Type
  1. Intel® Atom™ 4 items
  2. Intel® Celeron® 4 items
  3. Intel® Pentium® 4 items
  4. NVIDIA Tegra® T30 1 item
  5. NXP i.MX 8M 2 items
  6. NXP i.MX 8M Mini 2 items
  7. NXP i.MX 8M Nano 1 item
  8. NXP i.MX 8X 1 item
  9. NXP i.MX 933/935 1 item
  10. NXP i.MX6 3 items
  11. NXP i.MX8 2 items
  12. Rockchip RK3399 1 item
  13. Rockchip RK3568 1 item
  14. Zynq® Ultras 1 item
  15. Qualcomm Dragonwing 1 item
Ethernet
  1. ETHERNET≥1 20 items
  2. ETHERNET≥2 14 items
Form Factor
  1. COM Express® 1 item
  2. Qseven 7 items
  3. SMARC 4 items
  4. Single Board Computer 8 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. 40x70 mm (µQseven, 1.57"x 2.76") 1 item
  3. ≤ 100 x 100mm 11 items
  4. ≤ 80 x 80mm 11 items
  5. ≥ 100 x 100mm 6 items
  6. COM Express® 1 item
Form Factor Specification
  1. 3,5" 5 items
  2. COM Express Compact 1 item
  3. embedded NUC 1 item
  4. Other SBCs 1 item
  5. Pico-ITX 1 item
  6. Qseven 70x70 mm 5 items
  7. µQseven 70x40 2 items
InstallationDepth
  1. memory ≤4 1 item
  2. memory ≤1 1 item
  3. memory ≤2 1 item
  4. soldered down 1 item
Memory
  1. memory ≤1 34 items
  2. memory ≤16 9 items
  3. memory ≤2 34 items
  4. memory ≤4 30 items
  5. memory ≤8 20 items
  6. memory ≥32 9 items
  7. soldered down 20 items
  8. SO_DIMM 13 items
  9. UFS 3.1 module on-board 1 item
  10. I2C EEPROM 1 item
Mass Storage
  1. mSATA half-size slot 1 item
  2. onboard SSD 3 items
  3. standard SATA connector 1 item
  4. soldered down 1 item
  5. M.2 SATA SSD slot 2 items
  6. microSD card slot 8 items
  7. onboard eMMC 17 items
  8. onboard eMMC 1 item
  9. SATA channels ≥ 1 9 items
  10. SATA channels ≥ 2 1 item
  11. SD interface 10 items
  12. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 16 items
  2. -40°C ÷ +85°C 16 items
  3. 0°C ÷ +50°C 18 items
  4. 0°C ÷ +60°C 20 items
  5. 20°C ÷ +70°C 17 items
Pci Express
  1. PCI-e lanes ≥ 1 13 items
  2. PCI-e lanes ≥ 2 8 items
  3. PCI-e lanes ≥ 3 5 items
  4. PCI-e lanes ≥ 4 4 items
  5. PCI-e lanes ≥ 5 1 item
ScreenDimension
  1. TTL Uarts ≥1 1 item
Ttl Uarts
  1. TTL Uarts ≥1 15 items
  2. TTL Uarts ≥2 12 items
  3. TTL Uarts ≥3 7 items
USB
  1. USB 2.0 ≥ 1 17 items
  2. USB 2.0 ≥ 2 16 items
  3. USB 2.0 ≥ 3 15 items
  4. USB 2.0 ≥ 4 13 items
  5. USB 2.0 ≥ 5 7 items
  6. USB 2.0 ≥ 6 4 items
  7. USB 3.0 ≥ 1 11 items
  8. USB 3.0 ≥ 2 7 items
  9. USB 3.0 ≥ 3 1 item
  10. USB 3.0 ≥ 4 1 item
  11. USB OTG 11 items
Video Interfaces
  1. DP 12 items
  2. DP++ 13 items
  3. DUAL CHANNEL LVDS 24 items
  4. eDP 18 items
  5. HDMI 20 items
  6. MIPI-CSI camera conn 7 items
  7. MIPI-DSI 5 items
  8. SINGLE CHANNEL LVDS 20 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 items
  2. M.2 SOCKET 2 KEY 2 items
  3. M.2 Socket 2 key B 2 items
  4. ONBOARD WI-FI/BLE 9 items
  5. /Q/7/Q7-C26_70x70mm_1000x1000px_15_1.jpg 1 item
Nos Produits
  • Computer on Module
  • Single Board Computer
  • Human Machine Interface
  • Fanless Embedded PCs
  • Industrial Embedded PCs
  • Payment Systems
  • Kits de développement et accessoires
  • AI-Optimized Hardware
  • TFT Display
  • Modular Vision
  • Dev Kits, Carrier Boards and Accessories
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solution