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COM Express®
COM-HPC®
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SMARC®
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Computer on Module

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  1. Pci Express
    PCI-e lanes ≥ 4
  2. Video Interfaces
    MIPI-DSI
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Cpu Maker
  1. Intel 1 item
  2. Qualcomm 1 item
Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range < 10 W 1 item
Cpu Type
  1. Intel® Atom™ 1 item
  2. Intel® Celeron® 1 item
  3. Intel® Pentium® 1 item
  4. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 1 item
  2. ETHERNET≥2 2 items
Form Factor Dimensions
  1. ≤ 100 x 100mm 2 items
  2. ≤ 80 x 80mm 1 item
Memory
  1. memory ≤1 1 item
  2. memory ≤2 1 item
  3. memory ≤4 1 item
  4. memory ≤8 1 item
  5. soldered down 2 items
  6. memory ≤32 1 item
Mass Storage
  1. onboard eMMC 1 item
  2. SATA channels ≥ 1 1 item
  3. SD interface 1 item
  4. SD interface 1 item
  5. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 1 item
  2. -40°C ÷ +85°C 2 items
  3. 0°C ÷ +50°C 1 item
  4. 0°C ÷ +60°C 2 items
  5. 20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 7 items
  2. PCI-e lanes ≥ 2 5 items
  3. PCI-e lanes ≥ 3 1 item
  4. PCI-e lanes ≥ 4 2 items
Ttl Uarts
  1. TTL Uarts ≥1 1 item
  2. TTL Uarts ≥2 1 item
  3. TTL Uarts ≥3 2 items
USB
  1. USB 2.0 ≥ 1 1 item
  2. USB 2.0 ≥ 2 1 item
  3. USB 2.0 ≥ 3 1 item
  4. USB 2.0 ≥ 4 1 item
  5. USB 2.0 ≥ 5 2 items
  6. USB 2.0 ≥ 6 1 item
  7. USB 3.0 ≥ 1 1 item
  8. USB 3.0 ≥ 2 2 items
Video Interfaces
  1. DDI 13 items
  2. DP 16 items
  3. DP++ 10 items
  4. DUAL CHANNEL LVDS 18 items
  5. eDP 23 items
  6. HDMI 19 items
  7. MIPI-CSI camera conn 6 items
  8. MIPI-DSI 2 items
  9. PARALLEL RGB 1 item
  10. SINGLE CHANNEL LVDS 17 items
  11. VGA 4 items
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®