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COM Express®
COM-HPC®
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SMARC®
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Computer on Module

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  1. Mass Storage
    SD interface
  2. USB
    USB 2.0 ≥ 5
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Shopping Options
Cpu Maker
  1. NXP 1 item
  2. Qualcomm 1 item
Cpu Type
  1. NXP i.MX 95 1 item
  2. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 1 item
  2. ETHERNET≥2 2 items
Memory
  1. memory ≤1 1 item
  2. memory ≤16 1 item
  3. memory ≤2 1 item
  4. memory ≤4 1 item
  5. memory ≤8 1 item
  6. soldered down 1 item
  7. memory ≤32 1 item
Mass Storage
  1. CFAST slot 1 item
  2. M.2 NVMe SSD slot 2 items
  3. microSD card slot 3 items
  4. onboard eMMC 13 items
  5. onboard eMMC 2 items
  6. SATA channels ≥ 1 17 items
  7. SATA channels ≥ 2 14 items
  8. SATA channels ≥ 3 3 items
  9. SATA channels ≥ 4 1 item
  10. SD interface 4 items
  11. SD interface 2 items
  12. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 1 item
  2. -40°C ÷ +85°C 2 items
  3. 0°C ÷ +50°C 1 item
  4. 0°C ÷ +60°C 2 items
  5. 20°C ÷ +70°C 1 item
  6. -20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 1 item
  2. PCI-e lanes ≥ 2 1 item
  3. PCI-e lanes ≥ 4 1 item
Ttl Uarts
  1. TTL Uarts ≥1 1 item
  2. TTL Uarts ≥2 1 item
  3. TTL Uarts ≥3 2 items
USB
  1. USB 2.0 ≥ 1 3 items
  2. USB 2.0 ≥ 2 3 items
  3. USB 2.0 ≥ 3 3 items
  4. USB 2.0 ≥ 4 3 items
  5. USB 2.0 ≥ 5 2 items
  6. USB 2.0 ≥ 6 1 item
  7. USB 3.0 ≥ 2 1 item
  8. USB 3.1 ≥ 1 2 items
  9. USB OTG 1 item
Video Interfaces
  1. DP 1 item
  2. DUAL CHANNEL LVDS 1 item
  3. MIPI-CSI camera conn 1 item
  4. MIPI-DSI 1 item
  5. SINGLE CHANNEL LVDS 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®