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    onboard eMMC
  2. Video Interfaces
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Cpu Maker
  1. Intel 1 item
  2. NXP 7 items
  3. Qualcomm 1 item
Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range < 10 W 2 items
  3. range < 5 W 5 items
Cpu Type
  1. Intel® Atom™ 1 item
  2. Intel® Celeron® 1 item
  3. Intel® Pentium® 1 item
  4. NXP i.MX 8M 2 items
  5. NXP i.MX 8M Mini 2 items
  6. NXP i.MX 8M Nano 1 item
  7. NXP i.MX 8M Plus 1 item
  8. NXP i.MX 8X 1 item
  9. NXP i.MX 933/935 1 item
  10. Qualcomm Snapdragon 1 item
Ethernet
  1. ETHERNET≥1 8 items
  2. ETHERNET≥2 4 items
Form Factor
  1. Myon MicroModule SOM 2 items
  2. SMARC 4 items
  3. Trizeps SODIMM SOM 3 items
Form Factor Dimensions
  1. 48,5 x 32,5 mm 2 items
  2. 67,6 x 36,7 mm 3 items
  3. ≤ 100 x 100mm 3 items
  4. ≤ 80 x 80mm 4 items
Memory
  1. memory ≤1 8 items
  2. memory ≤2 9 items
  3. memory ≤4 7 items
  4. memory ≤8 5 items
  5. soldered down 4 items
Mass Storage
  1. M.2 NVMe SSD slot 1 item
  2. onboard eMMC 9 items
  3. onboard eMMC 2 items
  4. SATA channels ≥ 1 1 item
  5. SATA channels ≥ 2 1 item
  6. SD interface 4 items
  7. SD interface 3 items
  8. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 3 items
  2. -40°C ÷ +85°C 8 items
  3. 0°C ÷ +50°C 3 items
  4. 0°C ÷ +60°C 4 items
  5. 20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 4 items
  2. PCI-e lanes ≥ 2 2 items
  3. PCI-e lanes ≥ 3 1 item
  4. PCI-e lanes ≥ 4 1 item
Ttl Uarts
  1. TTL Uarts ≥1 7 items
  2. TTL Uarts ≥2 7 items
  3. TTL Uarts ≥3 8 items
USB
  1. USB 2.0 ≥ 1 5 items
  2. USB 2.0 ≥ 2 5 items
  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 2 items
  5. USB 2.0 ≥ 5 1 item
  6. USB 2.0 ≥ 6 1 item
  7. USB 3.0 ≥ 1 5 items
  8. USB 3.0 ≥ 2 5 items
  9. USB OTG 4 items
Video Interfaces
  1. DDI 6 items
  2. DP 10 items
  3. DP++ 7 items
  4. DUAL CHANNEL LVDS 22 items
  5. eDP 17 items
  6. HDMI 19 items
  7. MIPI-CSI camera conn 6 items
  8. MIPI-DSI 9 items
  9. PARALLEL RGB 3 items
  10. SINGLE CHANNEL LVDS 21 items
  11. VGA 2 items
Wireless Connectivity
  1. ONBOARD WI-FI/BLE 3 items
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®