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COM Express®
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  1. Memory
    memory ≤16
  2. Operating Temperature
    0°C ÷ +50°C
  3. Video Interfaces
    MIPI-CSI camera conn
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Shopping Options
Cpu Maker
  1. Intel 1 item
  2. NXP 1 item
Cpu Type
  1. Intel® Core™ 1 item
  2. NXP i.MX 952 1 item
Ethernet
  1. ETHERNET≥1 2 items
  2. ETHERNET≥2 1 item
Form Factor
  1. COM Express® 1 item
  2. SMARC 1 item
Form Factor Dimensions
  1. ≤ 100 x 100mm 1 item
  2. COM Express® 1 item
Form Factor Specification
  1. COM Express Basic 1 item
  2. ≤ 100 x 100mm 1 item
Memory
  1. memory ≤1 6 items
  2. memory ≤16 2 items
  3. memory ≤2 6 items
  4. memory ≤4 6 items
  5. memory ≤8 4 items
  6. memory ≥32 1 item
  7. soldered down 4 items
  8. SO_DIMM 1 item
Mass Storage
  1. M.2 NVMe SSD slot 1 item
  2. onboard eMMC 1 item
  3. SATA channels ≥ 1 1 item
  4. SATA channels ≥ 2 1 item
  5. SD interface 1 item
Operating Temperature
  1. -20°C ÷ +60°C 1 item
  2. -40°C ÷ +85°C 2 items
  3. 0°C ÷ +50°C 2 items
  4. 0°C ÷ +60°C 3 items
  5. 20°C ÷ +70°C 1 item
  6. -20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 2 items
  3. PCI-e lanes ≥ 3 1 item
  4. PCI-e lanes ≥ 4 1 item
  5. PCI-e lanes ≥ 5 1 item
Ttl Uarts
  1. TTL Uarts ≥1 2 items
  2. TTL Uarts ≥2 2 items
  3. TTL Uarts ≥3 1 item
USB
  1. USB 2.0 ≥ 1 2 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 2 items
  5. USB 2.0 ≥ 5 2 items
  6. USB 2.0 ≥ 6 2 items
  7. USB 3.0 ≥ 1 1 item
  8. USB 3.0 ≥ 2 1 item
  9. USB 3.0 ≥ 3 1 item
  10. USB 3.0 ≥ 4 1 item
  11. USB OTG 1 item
Video Interfaces
  1. DDI 9 items
  2. DP 8 items
  3. DP++ 2 items
  4. DUAL CHANNEL LVDS 10 items
  5. eDP 11 items
  6. HDMI 11 items
  7. MIPI-CSI camera conn 2 items
  8. PARALLEL RGB 1 item
  9. SINGLE CHANNEL LVDS 10 items
  10. VGA 2 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®