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COM Express®
COM-HPC®
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SMARC®
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Trizeps SODIMM (SOM)
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Computer on Module

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  1. Memory
    soldered down
  2. USB
    USB 2.0 ≥ 6
  3. Video Interfaces
    DP
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Shopping Options
Cpu Maker
  1. Intel 1 item
  2. Qualcomm 1 item
Cpu Type
  1. Intel® Atom™ 1 item
  2. Qualcomm Dragonwing 1 item
Ethernet
  1. ETHERNET≥1 2 items
  2. ETHERNET≥2 1 item
Form Factor
  1. COM Express® 1 item
  2. SMARC 1 item
Form Factor Dimensions
  1. ≤ 100 x 100mm 1 item
  2. COM Express® 1 item
Form Factor Specification
  1. COM Express Compact 1 item
Memory
  1. memory ≤1 10 items
  2. memory ≤16 10 items
  3. memory ≤2 10 items
  4. memory ≤4 11 items
  5. memory ≤8 11 items
  6. memory ≥32 9 items
  7. soldered down 2 items
  8. SO_DIMM 13 items
  9. UFS 3.1 module on-board 1 item
  10. I2C EEPROM 1 item
Mass Storage
  1. soldered down 1 item
  2. onboard eMMC 1 item
  3. SATA channels ≥ 1 1 item
  4. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -40°C ÷ +85°C 2 items
  2. 0°C ÷ +60°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 1 item
  2. PCI-e lanes ≥ 2 1 item
  3. PCI-e lanes ≥ 3 1 item
  4. PCI-e lanes ≥ 4 1 item
  5. PCI-e lanes ≥ 5 1 item
Ttl Uarts
  1. TTL Uarts ≥1 1 item
  2. TTL Uarts ≥2 2 items
USB
  1. USB 2.0 ≥ 1 7 items
  2. USB 2.0 ≥ 2 7 items
  3. USB 2.0 ≥ 3 7 items
  4. USB 2.0 ≥ 4 6 items
  5. USB 2.0 ≥ 5 4 items
  6. USB 2.0 ≥ 6 2 items
  7. USB 3.0 ≥ 1 3 items
  8. USB 3.0 ≥ 2 2 items
  9. USB 3.0 ≥ 4 1 item
  10. USB 3.1 ≥ 1 3 items
  11. USB 3.2 ≥ 1 1 item
  12. USB 3.2 ≥ 2 1 item
  13. USB OTG 3 items
Video Interfaces
  1. DP 2 items
  2. DP++ 7 items
  3. DUAL CHANNEL LVDS 5 items
  4. eDP 8 items
  5. HDMI 4 items
  6. MIPI-CSI camera conn 5 items
  7. MIPI-DSI 1 item
  8. SINGLE CHANNEL LVDS 3 items
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®