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COM Express®
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  1. Memory
    soldered down
  2. Operating Temperature
    -40°C ÷ +85°C
  3. Ttl Uarts
    TTL Uarts ≥2
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Cpu Maker
  1. AMD 1 item
  2. Intel 4 items
  3. MediaTek 2 items
  4. NXP 5 items
  5. Qualcomm 1 item
Cpu Power Consumption
  1. range 10-25 W 3 items
  2. range < 10 W 8 items
Cpu Type
  1. Intel® Atom™ 4 items
  2. Intel® Celeron® 3 items
  3. Intel® Pentium® 3 items
  4. MediaTek Genio 510 1 item
  5. MediaTek Genio 700 1 item
  6. NXP i.MX 8M 2 items
  7. NXP i.MX 8X 1 item
  8. NXP i.MX6 2 items
  9. Zynq® Ultras 1 item
  10. Qualcomm Dragonwing 1 item
Ethernet
  1. ETHERNET≥1 12 items
  2. ETHERNET≥2 5 items
Form Factor
  1. COM Express® 1 item
  2. Qseven 4 items
  3. SMARC 8 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. ≤ 100 x 100mm 10 items
  3. ≤ 80 x 80mm 8 items
  4. COM Express® 1 item
Form Factor Specification
  1. COM Express Compact 1 item
  2. Qseven 70x70 mm 3 items
  3. µQseven 70x40 1 item
Memory
  1. memory ≤1 27 items
  2. memory ≤16 12 items
  3. memory ≤2 26 items
  4. memory ≤4 25 items
  5. memory ≤8 21 items
  6. memory ≥32 9 items
  7. soldered down 13 items
  8. SO_DIMM 12 items
  9. UFS 3.1 module on-board 1 item
  10. I2C EEPROM 1 item
Mass Storage
  1. onboard SSD 1 item
  2. soldered down 1 item
  3. microSD card slot 2 items
  4. onboard eMMC 11 items
  5. onboard eMMC 1 item
  6. SATA channels ≥ 1 5 items
  7. SATA channels ≥ 2 1 item
  8. SD interface 7 items
  9. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 13 items
  2. -20°C ÷ +70°C 1 item
  3. -40°C ÷ +85°C 13 items
  4. 0°C ÷ +50°C 13 items
  5. 0°C ÷ +60°C 16 items
  6. 20°C ÷ +70°C 12 items
  7. -20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 9 items
  2. PCI-e lanes ≥ 2 5 items
  3. PCI-e lanes ≥ 3 4 items
  4. PCI-e lanes ≥ 4 5 items
  5. PCI-e lanes ≥ 5 1 item
Ttl Uarts
  1. TTL Uarts ≥1 14 items
  2. TTL Uarts ≥2 13 items
  3. TTL Uarts ≥3 8 items
USB
  1. USB 2.0 ≥ 1 11 items
  2. USB 2.0 ≥ 2 11 items
  3. USB 2.0 ≥ 3 10 items
  4. USB 2.0 ≥ 4 8 items
  5. USB 2.0 ≥ 5 6 items
  6. USB 2.0 ≥ 6 5 items
  7. USB 3.0 ≥ 1 5 items
  8. USB 3.0 ≥ 2 4 items
  9. USB 3.0 ≥ 4 1 item
  10. USB 3.1 ≥ 1 3 items
  11. USB 3.1 ≥ 2 1 item
  12. USB 3.2 ≥ 1 1 item
  13. USB 3.2 ≥ 2 2 items
  14. USB OTG 5 items
Video Interfaces
  1. DP 5 items
  2. DP++ 4 items
  3. DUAL CHANNEL LVDS 11 items
  4. eDP 8 items
  5. HDMI 9 items
  6. MIPI-CSI camera conn 5 items
  7. MIPI-DSI 3 items
  8. SINGLE CHANNEL LVDS 8 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
  2. ONBOARD WI-FI/BLE 4 items
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®