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Computer on Module
COM Express®
COM-HPC®
Qseven®
SMARC®
Myon MicroModule (SOM)
Trizeps SODIMM (SOM)
ETX®

Computer on Module

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  1. Form Factor Specification
    COM Express Compact
  2. Memory
    soldered down
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Form Factor Specification
  1. COM Express Basic 1 item
  2. COM Express Compact 1 item
  3. Qseven 70x70 mm 5 items
  4. µQseven 70x40 2 items
Memory
  1. memory ≤1 8 items
  2. memory ≤16 8 items
  3. memory ≤2 9 items
  4. memory ≤4 9 items
  5. memory ≤8 9 items
  6. memory ≥32 7 items
  7. soldered down 1 item
  8. SO_DIMM 10 items
  9. UFS 3.1 module on-board 1 item
  10. I2C EEPROM 1 item
Mass Storage
  1. soldered down 1 item
  2. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -40°C ÷ +85°C 1 item
  2. 0°C ÷ +60°C 1 item
USB
  1. USB 2.0 ≥ 6 1 item
  2. USB 3.0 ≥ 4 1 item
Video Interfaces
  1. DP 1 item
  2. DUAL CHANNEL LVDS 1 item
  3. eDP 1 item
  4. MIPI-CSI camera conn 1 item
  5. SINGLE CHANNEL LVDS 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®