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COM Express®
COM-HPC®
Qseven®
SMARC®
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Trizeps SODIMM (SOM)
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Computer on Module

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  1. Form Factor Dimensions
    120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout)
  2. USB
    USB 2.0 ≥ 1
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Shopping Options
Cpu Maker
  1. NXP 1 item
  2. Rockchip 1 item
Cpu Power Consumption
  1. range < 10 W 1 item
Cpu Type
  1. NXP i.MX6 1 item
  2. Rockchip RK3588 1 item
Form Factor
  1. COM Express® 1 item
  2. Qseven 1 item
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 2 items
  2. 40x70 mm (µQseven, 1.57"x 2.76") 3 items
  3. 48,5 x 32,5 mm 1 item
  4. 67,6 x 36,7 mm 2 items
  5. ≤ 100 x 100mm 29 items
  6. ≤ 80 x 80mm 14 items
  7. ≥ 100 x 100mm 3 items
  8. COM Express® 1 item
Form Factor Specification
  1. COM Express Basic 1 item
  2. µQseven 70x40 1 item
Memory
  1. memory ≤1 1 item
  2. memory ≤2 1 item
  3. memory ≥32 1 item
  4. soldered down 1 item
Mass Storage
  1. microSD card slot 1 item
  2. onboard eMMC 2 items
  3. SATA channels ≥ 1 1 item
  4. SD interface 1 item
Operating Temperature
  1. -20°C ÷ +60°C 1 item
  2. -40°C ÷ +85°C 2 items
  3. 0°C ÷ +50°C 1 item
  4. 0°C ÷ +60°C 2 items
  5. 20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 1 item
  2. PCI-e lanes ≥ 4 1 item
Ttl Uarts
  1. TTL Uarts ≥1 1 item
  2. TTL Uarts ≥2 2 items
USB
  1. USB 2.0 ≥ 1 2 items
  2. USB 2.0 ≥ 2 1 item
  3. USB 2.0 ≥ 3 1 item
  4. USB 2.0 ≥ 4 1 item
  5. USB 4.0 ≥ 2 2 items
  6. USB CLIENT 1 item
  7. USB OTG 4 items
Video Interfaces
  1. DP 1 item
  2. DUAL CHANNEL LVDS 1 item
  3. eDP 1 item
  4. HDMI 2 items
  5. SINGLE CHANNEL LVDS 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®