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COM Express®
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Computer on Module

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  1. Form Factor Dimensions
    ≤ 100 x 100mm
  2. USB
    USB OTG
  3. Video Interfaces
    eDP
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Shopping Options
Cpu Maker
  1. AMD 1 item
  2. NXP 1 item
Cpu Power Consumption
  1. range < 10 W 1 item
Cpu Type
  1. AMD® Ryzen™ embedded 1 item
  2. NXP i.MX 8M 1 item
Ethernet
  1. ETHERNET≥1 1 item
Form Factor
  1. COM Express® 1 item
  2. Qseven 1 item
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 3 items
  2. ≤ 100 x 100mm 2 items
  3. ≤ 80 x 80mm 1 item
  4. ≥ 100 x 100mm 1 item
Form Factor Specification
  1. COM Express Compact 1 item
  2. Qseven 70x70 mm 1 item
Memory
  1. memory ≤1 1 item
  2. memory ≤2 2 items
  3. memory ≤4 1 item
  4. soldered down 1 item
Mass Storage
  1. microSD card slot 1 item
  2. onboard eMMC 1 item
Operating Temperature
  1. -20°C ÷ +60°C 1 item
  2. -40°C ÷ +85°C 1 item
  3. 0°C ÷ +50°C 1 item
  4. 0°C ÷ +60°C 2 items
  5. 20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 1 item
  2. PCI-e lanes ≥ 5 1 item
Ttl Uarts
  1. TTL Uarts ≥1 1 item
  2. TTL Uarts ≥2 1 item
USB
  1. USB 2.0 ≥ 1 17 items
  2. USB 2.0 ≥ 2 17 items
  3. USB 2.0 ≥ 3 17 items
  4. USB 2.0 ≥ 4 16 items
  5. USB 2.0 ≥ 5 14 items
  6. USB 2.0 ≥ 6 14 items
  7. USB 3.0 ≥ 1 9 items
  8. USB 3.0 ≥ 2 8 items
  9. USB 3.0 ≥ 3 5 items
  10. USB 3.0 ≥ 4 3 items
  11. USB 3.1 ≥ 1 8 items
  12. USB 3.1 ≥ 2 5 items
  13. USB 3.2 ≥ 1 2 items
  14. USB 3.2 ≥ 2 3 items
  15. USB OTG 2 items
Video Interfaces
  1. DDI 1 item
  2. DP 3 items
  3. DUAL CHANNEL LVDS 6 items
  4. eDP 2 items
  5. HDMI 5 items
  6. MIPI-CSI camera conn 2 items
  7. MIPI-DSI 1 item
  8. SINGLE CHANNEL LVDS 6 items
Wireless Connectivity
  1. ONBOARD WI-FI/BLE 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®