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  1. Form Factor Dimensions
    ≤ 100 x 100mm
  2. USB
    USB 3.0 ≥ 2
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Shopping Options
Cpu Maker
  1. AMD 3 items
  2. Intel 6 items
  3. NXP 3 items
  4. Qualcomm 1 item
Cpu Power Consumption
  1. range 10-25 W 6 items
  2. range < 10 W 5 items
  3. range > 25 W 2 items
Cpu Type
  1. AMD Ryzen™ Embedded 1 item
  2. AMD® Ryzen™ embedded 1 item
  3. Intel® Atom™ 5 items
  4. Intel® Celeron® 3 items
  5. Intel® Core™ 3 items
  6. Intel® Pentium® 2 items
  7. NXP i.MX 8M 1 item
  8. NXP i.MX 8M Plus 1 item
  9. NXP i.MX 8X 1 item
  10. Zynq® Ultras 1 item
  11. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 10 items
  2. ETHERNET≥2 5 items
Form Factor
  1. COM Express® 6 items
  2. Qseven 1 item
  3. SMARC 6 items
Form Factor Dimensions
  1. 67,6 x 36,7 mm 2 items
  2. ≤ 100 x 100mm 13 items
  3. ≤ 80 x 80mm 6 items
  4. ≥ 100 x 100mm 3 items
  5. COM Express® 1 item
Form Factor Specification
  1. COM Express Compact 6 items
  2. Qseven 70x70 mm 1 item
Memory
  1. memory ≤1 12 items
  2. memory ≤16 5 items
  3. memory ≤2 11 items
  4. memory ≤4 12 items
  5. memory ≤8 9 items
  6. memory ≥32 2 items
  7. soldered down 7 items
  8. SO_DIMM 6 items
  9. memory ≤32 1 item
Mass Storage
  1. onboard eMMC 10 items
  2. SATA channels ≥ 1 9 items
  3. SATA channels ≥ 2 7 items
  4. SD interface 7 items
  5. SD interface 1 item
  6. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 10 items
  2. -40°C ÷ +85°C 12 items
  3. 0°C ÷ +50°C 10 items
  4. 0°C ÷ +60°C 12 items
  5. 20°C ÷ +70°C 10 items
  6. -20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 12 items
  2. PCI-e lanes ≥ 2 10 items
  3. PCI-e lanes ≥ 3 9 items
  4. PCI-e lanes ≥ 4 10 items
  5. PCI-e lanes ≥ 5 5 items
Ttl Uarts
  1. TTL Uarts ≥1 11 items
  2. TTL Uarts ≥2 10 items
  3. TTL Uarts ≥3 5 items
USB
  1. USB 2.0 ≥ 1 29 items
  2. USB 2.0 ≥ 2 29 items
  3. USB 2.0 ≥ 3 27 items
  4. USB 2.0 ≥ 4 25 items
  5. USB 2.0 ≥ 5 21 items
  6. USB 2.0 ≥ 6 19 items
  7. USB 3.0 ≥ 1 17 items
  8. USB 3.0 ≥ 2 13 items
  9. USB 3.0 ≥ 3 6 items
  10. USB 3.0 ≥ 4 4 items
  11. USB 3.1 ≥ 1 9 items
  12. USB 3.1 ≥ 2 5 items
  13. USB 3.2 ≥ 1 2 items
  14. USB 3.2 ≥ 2 3 items
  15. USB OTG 8 items
Video Interfaces
  1. DDI 6 items
  2. DP 8 items
  3. DP++ 3 items
  4. DUAL CHANNEL LVDS 13 items
  5. eDP 9 items
  6. HDMI 11 items
  7. MIPI-CSI camera conn 3 items
  8. MIPI-DSI 4 items
  9. SINGLE CHANNEL LVDS 13 items
Wireless Connectivity
  1. ONBOARD WI-FI/BLE 3 items
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®