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COM Express®
COM-HPC®
Qseven®
SMARC®
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Trizeps SODIMM (SOM)
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Computer on Module

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  1. Form Factor
    Qseven
  2. Ttl Uarts
    TTL Uarts ≥2
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Shopping Options
Cpu Maker
  1. Intel 1 item
  2. NXP 4 items
Cpu Type
  1. Intel® Atom™ 1 item
  2. Intel® Celeron® 1 item
  3. Intel® Pentium® 1 item
  4. NXP i.MX 8M 1 item
  5. NXP i.MX 8M Mini 1 item
  6. NXP i.MX 8M Nano 1 item
  7. NXP i.MX6 2 items
Form Factor
  1. COM Express® 16 items
  2. COM-HPC® 3 items
  3. Myon MicroModule SOM 1 item
  4. Qseven 5 items
  5. SMARC 12 items
  6. Trizeps SODIMM SOM 4 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. 40x70 mm (µQseven, 1.57"x 2.76") 1 item
  3. ≤ 100 x 100mm 3 items
  4. ≤ 80 x 80mm 4 items
Form Factor Specification
  1. Qseven 70x70 mm 3 items
  2. µQseven 70x40 2 items
Memory
  1. memory ≤1 5 items
  2. memory ≤16 1 item
  3. memory ≤2 5 items
  4. memory ≤4 4 items
  5. memory ≤8 1 item
  6. soldered down 5 items
Mass Storage
  1. onboard SSD 1 item
  2. microSD card slot 2 items
  3. onboard eMMC 5 items
  4. SATA channels ≥ 1 1 item
  5. SATA channels ≥ 2 1 item
  6. SD interface 4 items
Operating Temperature
  1. -20°C ÷ +60°C 4 items
  2. -40°C ÷ +85°C 4 items
  3. 0°C ÷ +50°C 4 items
  4. 0°C ÷ +60°C 5 items
  5. 20°C ÷ +70°C 4 items
Pci Express
  1. PCI-e lanes ≥ 1 4 items
  2. PCI-e lanes ≥ 4 1 item
Ttl Uarts
  1. TTL Uarts ≥1 9 items
  2. TTL Uarts ≥2 5 items
USB
  1. USB 2.0 ≥ 1 4 items
  2. USB 2.0 ≥ 2 4 items
  3. USB 2.0 ≥ 3 4 items
  4. USB 2.0 ≥ 4 4 items
  5. USB 2.0 ≥ 5 2 items
  6. USB 2.0 ≥ 6 1 item
  7. USB 3.0 ≥ 1 1 item
  8. USB 3.2 ≥ 2 1 item
  9. USB OTG 3 items
Video Interfaces
  1. DP 1 item
  2. DP++ 1 item
  3. DUAL CHANNEL LVDS 4 items
  4. eDP 3 items
  5. HDMI 3 items
  6. MIPI-CSI camera conn 1 item
  7. SINGLE CHANNEL LVDS 4 items
Wireless Connectivity
  1. ONBOARD WI-FI/BLE 2 items
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®