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COM Express®
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  1. Ethernet
    ETHERNET≥2
  2. USB
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  3. Video Interfaces
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Shopping Options
Cpu Maker
  1. Intel 1 item
  2. NXP 1 item
Cpu Type
  1. Intel® Core™ 1 item
  2. NXP i.MX 8M Plus 1 item
Ethernet
  1. ETHERNET≥1 7 items
  2. ETHERNET≥2 2 items
Form Factor
  1. COM-HPC® 1 item
  2. SMARC 1 item
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. ≤ 100 x 100mm 1 item
  3. ≤ 80 x 80mm 1 item
Form Factor Specification
  1. COM-HPC Client 1 item
Memory
  1. memory ≤1 1 item
  2. memory ≤2 1 item
  3. memory ≤4 1 item
  4. soldered down 1 item
  5. SO_DIMM 1 item
Mass Storage
  1. M.2 SATA SSD slot 1 item
  2. onboard eMMC 1 item
  3. SD interface 1 item
Operating Temperature
  1. -40°C ÷ +85°C 1 item
  2. 0°C ÷ +60°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 1 item
  2. PCI-e lanes ≥ 5 1 item
USB
  1. USB 2.0 ≥ 1 7 items
  2. USB 2.0 ≥ 2 7 items
  3. USB 2.0 ≥ 3 6 items
  4. USB 2.0 ≥ 4 6 items
  5. USB 2.0 ≥ 5 4 items
  6. USB 2.0 ≥ 6 4 items
  7. USB 3.0 ≥ 1 4 items
  8. USB 3.0 ≥ 2 4 items
  9. USB 3.1 ≥ 1 2 items
  10. USB 3.1 ≥ 2 2 items
  11. USB 3.2 ≥ 1 3 items
  12. USB 3.2 ≥ 2 3 items
  13. USB 4.0 ≥ 1 1 item
  14. USB 4.0 ≥ 2 1 item
  15. USB 4.0 ≥ 3 1 item
  16. USB 4.0 ≥ 4 2 items
  17. USB OTG 2 items
Video Interfaces
  1. DDI 1 item
  2. DP 1 item
  3. DUAL CHANNEL LVDS 2 items
  4. eDP 1 item
  5. HDMI 2 items
  6. MIPI-DSI 1 item
  7. SINGLE CHANNEL LVDS 3 items
Wireless Connectivity
  1. ONBOARD WI-FI/BLE 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®