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COM Express®
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  1. Ethernet
    ETHERNET≥2
  2. Ttl Uarts
    TTL Uarts ≥2
  3. Wireless Connectivity
    ONBOARD WI-FI/BLE
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Cpu Maker
  1. Intel 1 item
  2. NXP 1 item
Cpu Type
  1. Intel® Core™ 1 item
  2. NXP i.MX 8X 1 item
Ethernet
  1. ETHERNET≥1 4 items
  2. ETHERNET≥2 2 items
Form Factor
  1. COM-HPC® 1 item
  2. SMARC 1 item
Form Factor Dimensions
  1. ≤ 100 x 100mm 1 item
  2. ≤ 80 x 80mm 1 item
Form Factor Specification
  1. COM-HPC Client 1 item
Memory
  1. memory ≤1 1 item
  2. memory ≤2 1 item
  3. memory ≤4 1 item
  4. memory ≥32 1 item
  5. soldered down 1 item
  6. SO_DIMM 1 item
Mass Storage
  1. M.2 NVMe SSD slot 1 item
  2. onboard eMMC 1 item
  3. SATA channels ≥ 2 1 item
  4. SD interface 1 item
Operating Temperature
  1. -20°C ÷ +60°C 1 item
  2. -40°C ÷ +85°C 2 items
  3. 0°C ÷ +50°C 1 item
  4. 0°C ÷ +60°C 1 item
  5. 20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 1 item
  2. PCI-e lanes ≥ 5 1 item
Ttl Uarts
  1. TTL Uarts ≥1 1 item
  2. TTL Uarts ≥2 2 items
  3. TTL Uarts ≥3 2 items
USB
  1. USB 2.0 ≥ 1 1 item
  2. USB 2.0 ≥ 2 1 item
  3. USB 2.0 ≥ 3 1 item
  4. USB 2.0 ≥ 4 1 item
  5. USB 3.0 ≥ 1 1 item
  6. USB 3.0 ≥ 2 1 item
  7. USB 3.2 ≥ 2 1 item
  8. USB 4.0 ≥ 4 1 item
Video Interfaces
  1. DDI 1 item
  2. DP++ 1 item
  3. DUAL CHANNEL LVDS 1 item
  4. eDP 2 items
  5. HDMI 2 items
  6. MIPI-DSI 1 item
  7. SINGLE CHANNEL LVDS 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 3 items
  2. ONBOARD WI-FI/BLE 2 items
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®