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COM Express®
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  1. Ethernet
    ETHERNET≥2
  2. Operating Temperature
    -40°C ÷ +85°C
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Cpu Maker
  1. AMD 2 items
  2. Intel 5 items
  3. NXP 5 items
  4. Qualcomm 2 items
Cpu Power Consumption
  1. range 10-25 W 4 items
  2. range < 10 W 3 items
  3. range < 5 W 1 item
  4. range > 25 W 1 item
Cpu Type
  1. AMD EPYC™ Embedded 3 1 item
  2. Intel® Atom™ 3 items
  3. Intel® Celeron® 3 items
  4. Intel® Core™ 2 items
  5. Intel® Pentium® 2 items
  6. NXP i.MX 8M Plus 2 items
  7. NXP i.MX 8X 1 item
  8. NXP i.MX 933/935 1 item
  9. NXP i.MX 95 1 item
  10. Zynq® Ultras 1 item
  11. Qualcomm Dragonwing IQ-X 1 item
  12. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 35 items
  2. ETHERNET≥2 14 items
Form Factor
  1. COM Express® 2 items
  2. COM-HPC® 2 items
  3. SMARC 9 items
  4. Trizeps SODIMM SOM 1 item
Form Factor Dimensions
  1. 67,6 x 36,7 mm 1 item
  2. ≤ 100 x 100mm 8 items
  3. ≤ 80 x 80mm 6 items
  4. ≥ 100 x 100mm 1 item
  5. COM Express® 1 item
Form Factor Specification
  1. COM Express Basic 1 item
  2. COM-HPC Client 1 item
Memory
  1. memory ≤1 9 items
  2. memory ≤16 4 items
  3. memory ≤2 10 items
  4. memory ≤4 9 items
  5. memory ≤8 7 items
  6. memory ≥32 2 items
  7. soldered down 8 items
  8. SO_DIMM 3 items
  9. memory ≤32 1 item
  10. I2C EEPROM 1 item
  11. UFS 4.0 module on-board, optional, up to 256GB microSD card slot 1 item
Mass Storage
  1. I2C EEPROM 1 item
  2. M.2 NVMe SSD slot 2 items
  3. onboard eMMC 8 items
  4. onboard eMMC 1 item
  5. SATA channels ≥ 1 5 items
  6. SATA channels ≥ 2 2 items
  7. SATA channels ≥ 2 1 item
  8. SD interface 5 items
  9. SD interface 2 items
  10. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 item
  11. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 9 items
  2. -40°C ÷ +85°C 14 items
  3. 0°C ÷ +50°C 10 items
  4. 0°C ÷ +60°C 17 items
  5. 20°C ÷ +70°C 8 items
  6. -20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 9 items
  2. PCI-e lanes ≥ 2 7 items
  3. PCI-e lanes ≥ 3 5 items
  4. PCI-e lanes ≥ 4 6 items
  5. PCI-e lanes ≥ 5 2 items
Ttl Uarts
  1. TTL Uarts ≥1 9 items
  2. TTL Uarts ≥2 10 items
  3. TTL Uarts ≥3 7 items
USB
  1. USB 2.0 ≥ 1 8 items
  2. USB 2.0 ≥ 2 8 items
  3. USB 2.0 ≥ 3 7 items
  4. USB 2.0 ≥ 4 7 items
  5. USB 2.0 ≥ 5 5 items
  6. USB 2.0 ≥ 6 4 items
  7. USB 3.0 ≥ 1 5 items
  8. USB 3.0 ≥ 2 6 items
  9. USB 3.1 ≥ 1 2 items
  10. USB 3.1 ≥ 2 2 items
  11. USB 3.2 ≥ 1 2 items
  12. USB 3.2 ≥ 2 2 items
  13. USB 4.0 ≥ 1 1 item
  14. USB 4.0 ≥ 2 1 item
  15. USB 4.0 ≥ 3 1 item
  16. USB 4.0 ≥ 4 2 items
  17. USB OTG 4 items
Video Interfaces
  1. DDI 1 item
  2. DP 3 items
  3. DP++ 5 items
  4. DUAL CHANNEL LVDS 7 items
  5. eDP 6 items
  6. HDMI 8 items
  7. MIPI-CSI camera conn 3 items
  8. MIPI-DSI 6 items
  9. PARALLEL RGB 1 item
  10. SINGLE CHANNEL LVDS 7 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
  2. ONBOARD WI-FI/BLE 4 items
  3. /s/n/snapdragon-x_per_sito.jpg 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®