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COM Express®
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  1. Cpu Type
    NXP i.MX 8M Mini
  2. Operating Temperature
    -40°C ÷ +85°C
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Cpu Type
  1. AMD EPYC™ Embedded 3 1 item
  2. AMD Ryzen™ Embedded 2 items
  3. AMD® Ryzen™ embedded 1 item
  4. Intel® Atom™ 11 items
  5. Intel® Celeron® 10 items
  6. Intel® Core™ 9 items
  7. Intel® Pentium® 7 items
  8. Intel® Xeon® 1 item
  9. MediaTek Genio 510 1 item
  10. MediaTek Genio 700 1 item
  11. NXP i.MX 8M 3 items
  12. NXP i.MX 8M Mini 2 items
  13. NXP i.MX 8M Nano 1 item
  14. NXP i.MX 8M Plus 2 items
  15. NXP i.MX 8X 1 item
  16. NXP i.MX 933/935 1 item
  17. NXP i.MX 95 1 item
  18. NXP i.MX6 4 items
  19. NXP i.MX8 1 item
  20. Rockchip RK3588 1 item
  21. Zynq® Ultras 1 item
  22. Qualcomm Dragonwing IQ-X 1 item
  23. Qualcomm® Dragonwing IQ-8 1 item
Form Factor
  1. Myon MicroModule SOM 1 item
  2. Trizeps SODIMM SOM 1 item
Form Factor Dimensions
  1. 48,5 x 32,5 mm 1 item
  2. 67,6 x 36,7 mm 1 item
Memory
  1. memory ≤1 2 items
  2. memory ≤2 2 items
  3. memory ≤4 2 items
  4. memory ≤8 2 items
Operating Temperature
  1. -20°C ÷ +60°C 1 item
  2. -40°C ÷ +85°C 2 items
  3. 0°C ÷ +50°C 1 item
  4. 0°C ÷ +60°C 1 item
  5. 20°C ÷ +70°C 1 item
Ttl Uarts
  1. TTL Uarts ≥1 2 items
  2. TTL Uarts ≥2 2 items
  3. TTL Uarts ≥3 2 items
USB
  1. USB 2.0 ≥ 1 2 items
  2. USB 2.0 ≥ 2 2 items
  3. USB OTG 1 item
Video Interfaces
  1. DUAL CHANNEL LVDS 1 item
  2. MIPI-DSI 2 items
  3. PARALLEL RGB 1 item
  4. SINGLE CHANNEL LVDS 2 items
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®