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COM Express®
COM-HPC®
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SMARC®
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Computer on Module

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  1. Cpu Type
    NXP i.MX 8M
  2. Form Factor Dimensions
    ≤ 80 x 80mm
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Cpu Type
  1. Intel® Atom™ 7 items
  2. Intel® Celeron® 7 items
  3. Intel® Core™ 1 item
  4. Intel® Pentium® 4 items
  5. NXP i.MX 8M 2 items
  6. NXP i.MX 8M Mini 1 item
  7. NXP i.MX 8M Nano 1 item
  8. NXP i.MX 8M Plus 1 item
  9. NXP i.MX 8X 1 item
  10. NXP i.MX 933/935 1 item
  11. NXP i.MX6 1 item
  12. NXP i.MX8 1 item
  13. Zynq® Ultras 1 item
Form Factor
  1. Qseven 1 item
  2. SMARC 1 item
Form Factor Dimensions
  1. 67,6 x 36,7 mm 1 item
  2. ≤ 100 x 100mm 2 items
  3. ≤ 80 x 80mm 2 items
Form Factor Specification
  1. Qseven 70x70 mm 1 item
Memory
  1. memory ≤1 2 items
  2. memory ≤2 2 items
  3. memory ≤4 2 items
  4. soldered down 2 items
Mass Storage
  1. microSD card slot 1 item
  2. onboard eMMC 2 items
  3. SD interface 1 item
Operating Temperature
  1. -20°C ÷ +60°C 2 items
  2. -40°C ÷ +85°C 2 items
  3. 0°C ÷ +50°C 2 items
  4. 0°C ÷ +60°C 2 items
  5. 20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 1 item
Ttl Uarts
  1. TTL Uarts ≥1 2 items
  2. TTL Uarts ≥2 2 items
  3. TTL Uarts ≥3 1 item
USB
  1. USB 2.0 ≥ 1 2 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 2.0 ≥ 3 1 item
  4. USB 2.0 ≥ 4 1 item
  5. USB 2.0 ≥ 5 1 item
  6. USB 3.0 ≥ 1 2 items
  7. USB 3.0 ≥ 2 1 item
  8. USB OTG 2 items
Video Interfaces
  1. DP 1 item
  2. DUAL CHANNEL LVDS 2 items
  3. eDP 1 item
  4. HDMI 2 items
  5. MIPI-CSI camera conn 1 item
  6. MIPI-DSI 1 item
  7. SINGLE CHANNEL LVDS 2 items
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®