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COM Express®
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Computer on Module

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  1. Cpu Maker
    NXP
  2. Memory
    memory ≤8
  3. Pci Express
    PCI-e lanes ≥ 1
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Shopping Options
Cpu Maker
  1. AMD 4 items
  2. Intel 15 items
  3. NXP 2 items
  4. Qualcomm 2 items
Cpu Power Consumption
  1. range < 5 W 1 item
Cpu Type
  1. NXP i.MX 8M 1 item
  2. NXP i.MX 95 1 item
Ethernet
  1. ETHERNET≥1 2 items
  2. ETHERNET≥2 1 item
Form Factor
  1. SMARC 1 item
  2. Trizeps SODIMM SOM 1 item
Form Factor Dimensions
  1. 67,6 x 36,7 mm 1 item
  2. ≤ 100 x 100mm 1 item
Memory
  1. memory ≤1 11 items
  2. memory ≤16 1 item
  3. memory ≤2 10 items
  4. memory ≤4 9 items
  5. memory ≤8 2 items
  6. soldered down 8 items
Mass Storage
  1. onboard eMMC 1 item
  2. onboard eMMC 1 item
  3. SD interface 1 item
Operating Temperature
  1. -20°C ÷ +60°C 1 item
  2. -40°C ÷ +85°C 2 items
  3. 0°C ÷ +50°C 1 item
  4. 0°C ÷ +60°C 1 item
  5. 20°C ÷ +70°C 1 item
  6. -20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 1 item
Ttl Uarts
  1. TTL Uarts ≥1 2 items
  2. TTL Uarts ≥2 2 items
  3. TTL Uarts ≥3 2 items
USB
  1. USB 2.0 ≥ 1 1 item
  2. USB 2.0 ≥ 2 1 item
  3. USB 2.0 ≥ 3 1 item
  4. USB 2.0 ≥ 4 1 item
  5. USB 2.0 ≥ 5 1 item
  6. USB 2.0 ≥ 6 1 item
  7. USB 3.0 ≥ 1 1 item
  8. USB 3.0 ≥ 2 1 item
  9. USB OTG 1 item
Video Interfaces
  1. DUAL CHANNEL LVDS 1 item
  2. MIPI-DSI 1 item
  3. PARALLEL RGB 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®