CHARON




Détails produit
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CHARON is a COM Express® Compact Type 6 with the AMD Ryzen™ Embedded V1000 processors designed by SECO mounting up to 4 Zen x86 CPU cores with the latest Radeon graphics and I/O controller on a single chip. It comes with up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory, a wide range of expansion ports, PCI-Express, Serial Ports, networking and video interfaces, all of which makes it an ideal solution for medical devices, digital signage, and gaming. |
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AMD Ryzen™ Embedded V1807B with AMD Radeon™ Vega 11 Graphics, Quad Core Dual Thread @ 3.35GHz (3.8 Boost), TDP 35-54W |
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4 |
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Up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC and non- ECC Memory modules (DDR4-2400 with V1605B, V1202B and V1404I) Up to 16GB @ 3200Mhz, up to 32GB @ 2400MHz supported |
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AMD Radeon™ Vega GPU with up to 11 Compute Units |
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3 x Digital Display Interfaces (DDIs), supporting DP 1.3, DVI and HDMI 1.4/2.0 |
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DDIs, eDP: up to 4K |
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2 x S-ATA Gen3 Channels |
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Gigabit Ethernet interface |
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4 x USB 3.0 Host ports |
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Up to 4x PCI-e x1 Gen3 lanes + 2 x PCI-e x1 Gen2 ports |
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HD Audio Interface |
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2 x UARTs |
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SPI, I2C bus, SM Bus, LPC bus, FAN management Optional TPM 1.2 module on-board |
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+12VDC ± 10% and + 5VSB (optional) |
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Microsoft® Windows 10 |
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0°C ÷ +60 °C (Commercial version)
*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
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95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout) |
Prices hereunder are valid for SAMPLES (purchase limited to 3pcs).
If you would like to know prices for higher volumes, please contact us.
MB75-6001-2111-C1-V | Description n° pièce COMe-B75-CT6 w/AMD Ryzen Embedded V1807B @ 3.35GHz - Ethernet Contr. I211 - EDP Port - HUB - Packet Switch - Comm. Temp |
En rupture de stock
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