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CARINA

Módulo cliente COM-HPC® de tamaño A con procesadores Intel® Core™ y Celeron® de 11.ª generación (antes Tiger Lake-UP3)

Available in Industrial Temperature Range

Ficha de datos

Para más información y recibir una cotización, póngase en contacto con nosotros

Contactarnos

Cpu

11th Gen Intel® Core™ processors and Intel® Celeron® processors

Gráficas

Intel® Iris Xe Graphics Core Gen12 GPU with up to 96 EU, up to 4 independent displays

Conectividad

4x USB 4.0 / USB 3.2; 4x USB 2.0; 8x PCI-e x1 Gen3 ; 1x PCI-e x4 Gen4; up to 2x 2.5GbE

Memoria

Two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory

Datos del producto

Información técnica

Descripción	Módulo cliente COM-HPC® de tamaño A con procesadores Intel® Core™ y Celeron® de 11.ª generación (antes Tiger Lake-UP3)
Cpu	11th Generation Intel® Core™ and Celeron® Processors, also available in industrial temperature range • Intel® Core™ i7-1185G7E, Quad Core @ 2.8GHz (4.4GHz in Turbo Boost) with HT, 12MB Cache, 28/15/12W cTDP • Intel® Core™ i5-1145G7E, Quad Core @ 2.6GHz (4.1GHz in Turbo Boost) with HT, 8MB Cache, 28/15/12W cTDP • Intel® Core™ i3-1115G4E, Dual Core @ 3.0GHz (3.9GHz in Turbo Boost) with HT, 6MB Cache, 28/15/12W cTDP • Intel® Celeron® 6305E, Dual Core @1.8GHz, 4MB Cache, 15W TDP • Intel® Core™ i7-1185GRE, Quad Core @ 2.8GHz (4.4GHz in Turbo Boost) with HT, 12MB Cache, with IBECC and Functional Safety Essential Design package, 28/15/12W cTDP – Industrial (w/ Turbo OFF) • Intel® Core™ i5-1145GRE, Quad Core @ 2.6GHz (4.1GHz in Turbo Boost) with HT, 8MB Cache, with IBECC and Functional Safety Essential Design package, 28/15/12W cTDP - Industrial (w/ Turbo OFF) •Intel® Core i3-1115GRE, Dual Core @ 3.0GHz (3.9GHz in Turbo Boost) with HT, 6MB Cache, 28/15/12W cTDP - Industrial (w/ Turbo OFF)
Núcleos máx.	4
Memoria	2x DDR4-3200 SODIMM Slots with IBECC (In-Band Error Correction Code), up to 64GB supported
Gráfica	Integrated Iris Xe Graphics Core Gen12 architecture, with up to 96 Execution Units MPEG2, WMV9, AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP9, AV1 HW decoding, up to 8k @60. AVC/H.264, HEVC/H.265, JPEG, VP9 HW encoding Support up to 4 independent displays.
Interfaces vídeos	1x eDP 1.4b or MIPI_DSI 1.3 Up to 3x DP++ interface, supporting Display Port 1.4a and HDMI 2.0b Up to 4x Display Port over Type-C (Alternate mode)
Resolución vídeo	DP, eDP: Up to 5120x3200 @60Hz 24bpp / 7680x4320@60Hz 30bpp with DSC MIPI-DSI: Up to 3200x2000 @60Hz 24 bpp, 5120x3200 @60Hz 24bpp with DSC HDMI 1.4: Up to 4Kx2K 24-30Hz 24bpp HDMI 2.0b: Up to 4Kx2K 48-60Hz 24bpp / 4Kx2K 48-60Hz 12bpc (need dedicated redriver on carrier board)
Almacenamiento en masa	2 x S-ATA Gen3 Channels PCI-e x4 port can be used to connect, on the carrier board, M.2 NVMe drives
Trabajo en red	Up to 2x NBase-T Ethernet interfaces, supporting 2.5Gb Ethernet connection, managed by as many Intel® i225 2.5GbE Controllers M.2 1216 SD Module supporting WiFi 802.11abgn+ac R2 MIMO 2x2 + MU-MIMO and Bluetooth 5.0
Usb	Up to 4 x USB 4.0 / USB 3.2 Host ports 4 x USB 2.0 Host port
Pci	1x PCI-e x4 Gen 4 port Up to 8x PCI-e Gen 3 lanes, groupable to support up to 4 root ports (5 root ports without the second 2.5GbE controller)
Audio	SoundWire and I2S Audio Interface
Puertos de serie	2 x UARTs
Otras interfaces	2x 4-lane CSI-2 interfaces, optional SPI, SM Bus, 2x I2C, Watchdog timer, Carrier board FAN Control Management signals, ACPI signals, Safety Status signals Deep Sleep / Battery support Optional TPM 2.0 module on-board 12x GPIOs
Alimentación eléctrica	+8VDC .. +20VDC Main power supply +5V stand-by
Sistema operativo	Windows 10 IoT Enterprise LTSC Linux Kernel LTS Yocto VxWorks 7.0 Android
Temperatura de funcionamiento	0°C ÷ +60°C (Commercial version) -40°C ÷ +85°C (Industrial version) *Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider applicationspecific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensiones	120 x 95 mm (Com HPC Size A Form factor, Client pinout)

Software

Enlace	SECO Technical Resources

Documentación

Data Sheet	[Datasheet] CARINA Rel. 1.4
Image	[Picture] CARINA_front [Picture] CARINA_back

Part Number

Prices hereunder are valid for SAMPLES (purchase limited to 3pcs).
If you would like to know prices for higher volumes, please contact us.

Elementos de artículos agrupados
HC77-3000-1120-C2	Descripción número de pieza HPC - CARINA w/Intel® Core™ i7-1185G7E, Quad Core @ 2.8GHz (4.4GHz in Turbo Boost), 12MB Cache, 28/15/12W cTDP, TPM 2.0, 8x PCI-e Gen 3, 1x eDP, 1x DP++, 4x USB 4.0, Comm. Temp.	Contactarnos
HC77-4000-1120-C2	Descripción número de pieza HPC - CARINA w/Intel® Celeron® 6305E, Dual Core @1.8GHz, 4MB Cache, 15W TDP, TPM 2.0, 8x PCI-e Gen 3, 1x eDP, 1x DP++, 4x USB 4.0, Comm. Temp.	Contactarnos
HC77-6000-1120-C2	Descripción número de pieza HPC - CARINA w/ Intel® Core™ i3-1115G4E, Dual Core @ 3.0GHz (3.9GHz in Turbo Boost), 6MB Cache, 28/15/12W cTDP, TPM 2.0, 8x PCI-e Gen 3, 1x eDP, 1x DP++, 4x USB 4.0, Comm. Temp.	Contactarnos

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